Issued Patents All Time
Showing 25 most recent of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462580 | Image sensor packages and related methods | Oswald Skeete, Brian A. Vaartstra | 2022-10-04 |
| 10770492 | Chip scale package and related methods | Bingzhi Su, Larry D. Kinsman | 2020-09-08 |
| 10079254 | Chip scale package and related methods | Bingzhi Su, Larry D. Kinsman | 2018-09-18 |
| 9754983 | Chip scale package and related methods | Bingzhi Su, Larry D. Kinsman | 2017-09-05 |
| 7561938 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2009-07-14 |
| 7387119 | Dicing saw with variable indexing capability | Salman Akram, Michael E. Hess, David R. Hembree | 2008-06-17 |
| 7166252 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Leonard E. Mess | 2007-01-23 |
| 7155300 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2006-12-26 |
| 7120513 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2006-10-10 |
| 7049840 | Hybrid interconnect and system for testing semiconductor dice | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, James M. Wark | 2006-05-23 |
| 7022533 | Substrate mapping | Warren M. Farnworth | 2006-04-04 |
| 7011532 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | David R. Hembree, Salman Akram | 2006-03-14 |
| 6970359 | Reduced-sized memory card package, length-extending adaptor and method of forming adaptor | Walter L. Moden, Michael W. Morrison | 2005-11-29 |
| 6939145 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | David R. Hembree, Salman Akram | 2005-09-06 |
| 6932077 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus | Salman Akram, Michael E. Hess, David R. Hembree | 2005-08-23 |
| 6897571 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2005-05-24 |
| 6888159 | Substrate mapping | Warren M. Farnworth | 2005-05-03 |
| 6865086 | Apparatus and method to secure an adaptor to a reduced-sized memory card | Walter L. Moden, Michael W. Morrison | 2005-03-08 |
| 6841796 | Substrate mapping | Warren M. Farnworth | 2005-01-11 |
| 6830719 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Leonard E. Mess | 2004-12-14 |
| 6808947 | Substrate mapping | Warren M. Farnworth | 2004-10-26 |
| 6806493 | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching | David R. Hembree, Salman Akram | 2004-10-19 |
| 6764549 | Method and apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Leonard E. Mess | 2004-07-20 |
| 6730999 | Clip chip carrier | Warren M. Farnworth, Alan G. Wood | 2004-05-04 |
| 6710612 | CSP BGA test socket with insert and method | Warren M. Farnworth, David R. Hembree | 2004-03-23 |