| 12442687 |
Optical sensor transparent cover with array contact grid |
Brian A. Vaartstra |
2025-10-14 |
|
| 11728360 |
Image sensor packages formed using temporary protection layers and related methods |
Swarnal Borthakur, Marc Sulfridge, Scott Churchwell, Brian A. Vaartstra |
2023-08-15 |
$89,239,000 |
| 11508776 |
Image sensor semiconductor packages and related methods |
Yusheng LIN, Yu-Te HSIEH, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo |
2022-11-22 |
$37,846,000 |
| 11499281 |
Biochar containment boom and blanket |
Adam Mohs |
2022-11-15 |
|
| 11342369 |
Image sensor packages formed using temporary protection layers and related methods |
Swarnal Borthakur, Marc Sulfridge, Scott Churchwell, Brian A. Vaartstra |
2022-05-24 |
$28,335,000 |
| 10770492 |
Chip scale package and related methods |
Bingzhi Su, Derek Gochnour |
2020-09-08 |
$14,116,000 |
| 10767460 |
Method of chemically delaying peroxygen based viscosity reduction reactions |
Adam Mohs, Marc Baures |
2020-09-08 |
|
| 10490588 |
Methods and apparatus for a thermal equalizer in an image sensor |
Swarnal Borthakur, Marc Sulfridge |
2019-11-26 |
$8,403,000 |
| 10388684 |
Image sensor packages formed using temporary protection layers and related methods |
Swarnal Borthakur, Marc Sulfridge, Scott Churchwell, Brian A. Vaartstra |
2019-08-20 |
$6,859,000 |
| 10290672 |
Image sensor semiconductor packages and related methods |
Yusheng LIN, Yu-Te HSIEH, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo |
2019-05-14 |
$6,504,000 |
| 10079254 |
Chip scale package and related methods |
Bingzhi Su, Derek Gochnour |
2018-09-18 |
$16,932,000 |
| 10053617 |
Method of chemically increasing the efficiency of peroxygen based viscosity reduction reactions |
Adam Mohs, Marc Baures |
2018-08-21 |
|
| 9947705 |
Image sensors with infrared-blocking layers |
Swarnal Borthakur |
2018-04-17 |
$16,083,000 |
| 9878301 |
Method and composition for the remediation of contaminants |
Adam Mohs |
2018-01-30 |
|
| 9771782 |
Method of chemically delaying peroxygen based viscosity reduction reactions |
Adam Mohs, Marc Baures |
2017-09-26 |
|
| 9754983 |
Chip scale package and related methods |
Bingzhi Su, Derek Gochnour |
2017-09-05 |
$15,614,000 |
| 9561530 |
Method for the in situ remediation of contaminants |
Adam Mohs |
2017-02-07 |
|
| 8981511 |
Multi-chip package for imaging systems |
Chi-Yao Kuo |
2015-03-17 |
$5,211,000 |
| 8791536 |
Stacked sensor packaging structure and method |
Yu-Te HSIEH |
2014-07-29 |
|
| 8097895 |
Electronic device package with an optical device |
— |
2012-01-17 |
|
| 7969810 |
256 Meg dynamic random access memory |
Brent Keeth, Layne Bunker, Scott J. Demer, Ronald Taylor, John S. Mullin +2 more |
2011-06-28 |
|
| 7919410 |
Packaging methods for imager devices |
Luke England |
2011-04-05 |
|
| 7871859 |
Vertical surface mount assembly and methods |
Jerry M. Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee |
2011-01-18 |
|
| 7829991 |
Stackable ceramic FBGA for high thermal applications |
Walter L. Moden, David J. Corisis, Leonard E. Mess |
2010-11-09 |
$3,205,000 |
| 7727858 |
Method for fabricating a chip scale package using wafer level processing |
Salman Akram |
2010-06-01 |
$3,541,000 |
