Issued Patents All Time
Showing 25 most recent of 232 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728360 | Image sensor packages formed using temporary protection layers and related methods | Swarnal Borthakur, Marc Sulfridge, Scott Churchwell, Brian A. Vaartstra | 2023-08-15 |
| 11508776 | Image sensor semiconductor packages and related methods | Yusheng LIN, Yu-Te HSIEH, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo | 2022-11-22 |
| 11499281 | Biochar containment boom and blanket | Adam Mohs | 2022-11-15 |
| 11342369 | Image sensor packages formed using temporary protection layers and related methods | Swarnal Borthakur, Marc Sulfridge, Scott Churchwell, Brian A. Vaartstra | 2022-05-24 |
| 10767460 | Method of chemically delaying peroxygen based viscosity reduction reactions | Adam Mohs, Marc Baures | 2020-09-08 |
| 10770492 | Chip scale package and related methods | Bingzhi Su, Derek Gochnour | 2020-09-08 |
| 10490588 | Methods and apparatus for a thermal equalizer in an image sensor | Swarnal Borthakur, Marc Sulfridge | 2019-11-26 |
| 10388684 | Image sensor packages formed using temporary protection layers and related methods | Swarnal Borthakur, Marc Sulfridge, Scott Churchwell, Brian A. Vaartstra | 2019-08-20 |
| 10290672 | Image sensor semiconductor packages and related methods | Yusheng LIN, Yu-Te HSIEH, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo | 2019-05-14 |
| 10079254 | Chip scale package and related methods | Bingzhi Su, Derek Gochnour | 2018-09-18 |
| 10053617 | Method of chemically increasing the efficiency of peroxygen based viscosity reduction reactions | Adam Mohs, Marc Baures | 2018-08-21 |
| 9947705 | Image sensors with infrared-blocking layers | Swarnal Borthakur | 2018-04-17 |
| 9878301 | Method and composition for the remediation of contaminants | Adam Mohs | 2018-01-30 |
| 9771782 | Method of chemically delaying peroxygen based viscosity reduction reactions | Adam Mohs, Marc Baures | 2017-09-26 |
| 9754983 | Chip scale package and related methods | Bingzhi Su, Derek Gochnour | 2017-09-05 |
| 9561530 | Method for the in situ remediation of contaminants | Adam Mohs | 2017-02-07 |
| 8981511 | Multi-chip package for imaging systems | Chi-Yao Kuo | 2015-03-17 |
| 8791536 | Stacked sensor packaging structure and method | Yu-Te HSIEH | 2014-07-29 |
| 8097895 | Electronic device package with an optical device | — | 2012-01-17 |
| 7969810 | 256 Meg dynamic random access memory | Brent Keeth, Layne Bunker, Scott J. Demer, Ronald Taylor, John S. Mullin +2 more | 2011-06-28 |
| 7919410 | Packaging methods for imager devices | Luke England | 2011-04-05 |
| 7871859 | Vertical surface mount assembly and methods | Jerry M. Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2011-01-18 |
| 7829991 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, David J. Corisis, Leonard E. Mess | 2010-11-09 |
| 7727858 | Method for fabricating a chip scale package using wafer level processing | Salman Akram | 2010-06-01 |
| 7638813 | Methods of fabrication for flip-chip image sensor packages | — | 2009-12-29 |