Issued Patents All Time
Showing 26–50 of 232 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7629686 | Bumped die and wire bonded board-on-chip package | — | 2009-12-08 |
| 7600314 | Methods for installing a plurality of circuit devices | Mike Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2009-10-13 |
| 7569418 | Methods for securing packaged semiconductor devices to carrier substrates | Walter L. Moden, Warren M. Farnworth | 2009-08-04 |
| 7541658 | Optically interactive device package array | — | 2009-06-02 |
| 7443038 | Flip-chip image sensor packages | — | 2008-10-28 |
| 7408255 | Assembly for stacked BGA packages | David J. Corisis, Walter L. Moden, Leonard E. Mess | 2008-08-05 |
| 7400032 | Module assembly for stacked BGA packages | David J. Corisis, Walter L. Moden, Leonard E. Mess | 2008-07-15 |
| 7396702 | Module assembly and method for stacked BGA packages | David J. Corisis, Walter L. Moden, Leonard E. Mess | 2008-07-08 |
| 7385298 | Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same | — | 2008-06-10 |
| 7384805 | Transfer mold semiconductor packaging processes | Richard W. Wensel, Jeff Reeder | 2008-06-10 |
| 7321455 | Microelectronic devices and methods for packaging microelectronic devices | — | 2008-01-22 |
| 7285442 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, David J. Corisis, Leonard E. Mess | 2007-10-23 |
| 7282789 | Back-to-back semiconductor device assemblies | — | 2007-10-16 |
| 7279797 | Module assembly and method for stacked BGA packages | David J. Corisis, Walter L. Moden, Leonard E. Mess | 2007-10-09 |
| 7259450 | Double-packaged multi-chip semiconductor module | Alan G. Wood, Eugene H. Cloud | 2007-08-21 |
| 7227261 | Vertical surface mount assembly and methods | Jerry M. Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2007-06-05 |
| 7214566 | Semiconductor device package and method | Alan G. Wood | 2007-05-08 |
| 7183191 | Method for fabricating a chip scale package using wafer level processing | Salman Akram | 2007-02-27 |
| 7151013 | Semiconductor package having exposed heat dissipating surface and method of fabrication | David J. Corisis, Mike Brooks, Mark S. Johnson | 2006-12-19 |
| 7148083 | Transfer mold semiconductor packaging processes | Richard W. Wensel, Jeff Reeder | 2006-12-12 |
| 7125749 | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages | Jerry M. Brooks | 2006-10-24 |
| 7122390 | Methods of fabrication for flip-chip image sensor packages | — | 2006-10-17 |
| 7115990 | Bumped die and wire bonded board-on-chip package | — | 2006-10-03 |
| 7116001 | Bumped die and wire bonded board-on-chip package | — | 2006-10-03 |
| 7112252 | Assembly method for semiconductor die and lead frame | Timothy J. Allen, Jerry M. Brooks | 2006-09-26 |