Issued Patents All Time
Showing 1–25 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11070625 | Server connection capacity management | Alan Hollingshead, Julian Horn, Philip I. Wakelin | 2021-07-20 |
| 10616346 | Server connection capacity management | Alan Hollingshead, Julian Horn, Philip I. Wakelin | 2020-04-07 |
| 10574758 | Server connection capacity management | Alan Hollingshead, Julian Horn, Philip I. Wakelin | 2020-02-25 |
| 7600314 | Methods for installing a plurality of circuit devices | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2009-10-13 |
| 7151013 | Semiconductor package having exposed heat dissipating surface and method of fabrication | David J. Corisis, Mark S. Johnson, Larry D. Kinsman | 2006-12-19 |
| 7065868 | Methods for installing a circuit device | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2006-06-27 |
| 7041537 | Method for fabricating semiconductor component with on board capacitor | Salman Akram | 2006-05-09 |
| 7002248 | Semiconductor components having multiple on board capacitors | Salman Akram | 2006-02-21 |
| 6975037 | Semiconductor package having flex circuit with external contacts | Warren M. Farnworth, Alan G. Wood | 2005-12-13 |
| 6924550 | Packaged microelectronic devices and methods for assembling microelectronic devices | David J. Corisis | 2005-08-02 |
| 6911355 | Semiconductor package having flex circuit with external contacts | Warren M. Farnworth, Alan G. Wood | 2005-06-28 |
| 6891248 | Semiconductor component with on board capacitor | Salman Akram | 2005-05-10 |
| 6740960 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Warren M. Farnworth, Alan G. Wood | 2004-05-25 |
| 6740546 | Packaged microelectronic devices and methods for assembling microelectronic devices | David J. Corisis | 2004-05-25 |
| 6681480 | Method and apparatus for installing a circuit device | Larry D. Kinsman, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2004-01-27 |
| 6618162 | Apparatus and method to configure a device, such as a printer, over a network | Christopher A. Wiklof, Pixie A. Austin, Jaye A. Jarchow | 2003-09-09 |
| 6614104 | Stackable semiconductor package having conductive layer and insulating layers | Warren M. Farnworth, Alan G. Wood | 2003-09-02 |
| 6539646 | Footwear sole with integral display element | Allen Sheets | 2003-04-01 |
| 6541856 | Thermally enhanced high density semiconductor package | David J. Corisis, Mark S. Johnson, Larry D. Kinsman | 2003-04-01 |
| 6501165 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Warren M. Farnworth, Alan G. Wood | 2002-12-31 |
| 6465877 | Semiconductor package including flex circuit, interconnects and dense array external contacts | Warren M. Farnworth, Alan G. Wood | 2002-10-15 |
| 6451624 | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication | Warren M. Farnworth, Alan G. Wood | 2002-09-17 |
| 6368896 | Method of wafer level chip scale packaging | Warren M. Farnworth, Alan G. Wood | 2002-04-09 |
| 6326242 | Semiconductor package with heat sink and method of fabrication | Walter L. Moden | 2001-12-04 |
| 6294824 | Bonding support for leads-over-chip process | Alan G. Wood | 2001-09-25 |