| 12396097 |
Substrates with continuous slot vias |
Travis M. Jensen, Stephen F. Moxham |
2025-08-19 |
|
| 12300597 |
Apparatuses including ball grid arrays and associated systems |
David K. Ovard, Thomas Hein, Timothy M. Hollis |
2025-05-13 |
|
| 11996359 |
Apparatuses including ball grid arrays and associated systems and methods |
David K. Ovard, Thomas Hein, Timothy M. Hollis |
2024-05-28 |
$28,459,000 |
| 11670578 |
Ball grid arrays and associated apparatuses and systems |
David K. Ovard, Thomas Hein, Timothy M. Hollis |
2023-06-06 |
$9,972,000 |
| 10083937 |
Semiconductor devices and packages and methods of forming semiconductor device packages |
Anthony D. Veches, William R. Stephenson |
2018-09-25 |
$17,810,000 |
| 9502369 |
Semiconductor devices and packages |
Anthony D. Veches, William R. Stephenson |
2016-11-22 |
$14,249,000 |
| 8299598 |
Grid array packages and assemblies including the same |
— |
2012-10-30 |
|
| 8198138 |
Methods for providing and using grid array packages |
— |
2012-06-12 |
|
| 8164175 |
Stackable semiconductor device assemblies |
— |
2012-04-24 |
|
| RE43112 |
Stackable ball grid array package |
David J. Corisis, Jerry M. Brooks |
2012-01-17 |
|
| 8049317 |
Grid array packages |
— |
2011-11-01 |
|
| 8035974 |
Integrated circuit package support system |
David J. Corisis, Terry R. Lee |
2011-10-11 |
|
| 7894192 |
Integrated circuit package support system |
David J. Corisis, Terry R. Lee |
2011-02-22 |
|
| 7871859 |
Vertical surface mount assembly and methods |
Larry D. Kinsman, Jerry M. Brooks, Warren M. Farnworth, Terry R. Lee |
2011-01-18 |
|
| 7829991 |
Stackable ceramic FBGA for high thermal applications |
David J. Corisis, Leonard E. Mess, Larry D. Kinsman |
2010-11-09 |
$3,205,000 |
| 7663224 |
Semiconductor BGA package having a segmented voltage plane |
Michael W. Morrison, Corey Jacobsen |
2010-02-16 |
$3,260,000 |
| 7600314 |
Methods for installing a plurality of circuit devices |
Larry D. Kinsman, Mike Brooks, Warren M. Farnworth, Terry R. Lee |
2009-10-13 |
$6,591,000 |
| 7569418 |
Methods for securing packaged semiconductor devices to carrier substrates |
Larry D. Kinsman, Warren M. Farnworth |
2009-08-04 |
$6,100,000 |
| 7501313 |
Method of making semiconductor BGA package having a segmented voltage plane |
Michael W. Morrison, Corey Jacobsen |
2009-03-10 |
$2,830,000 |
| 7408255 |
Assembly for stacked BGA packages |
David J. Corisis, Leonard E. Mess, Larry D. Kinsman |
2008-08-05 |
$1,916,000 |
| 7400032 |
Module assembly for stacked BGA packages |
David J. Corisis, Leonard E. Mess, Larry D. Kinsman |
2008-07-15 |
$1,858,000 |
| 7396702 |
Module assembly and method for stacked BGA packages |
David J. Corisis, Leonard E. Mess, Larry D. Kinsman |
2008-07-08 |
$1,892,000 |
| 7381591 |
Flip-chip adaptor package for bare die |
— |
2008-06-03 |
$3,879,000 |
| 7329945 |
Flip-chip adaptor package for bare die |
— |
2008-02-12 |
$1,579,000 |
| 7285442 |
Stackable ceramic FBGA for high thermal applications |
David J. Corisis, Leonard E. Mess, Larry D. Kinsman |
2007-10-23 |
$1,940,000 |
