Issued Patents All Time
Showing 25 most recent of 199 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396097 | Substrates with continuous slot vias | Travis M. Jensen, Stephen F. Moxham | 2025-08-19 |
| 12300597 | Apparatuses including ball grid arrays and associated systems | David K. Ovard, Thomas Hein, Timothy M. Hollis | 2025-05-13 |
| 11996359 | Apparatuses including ball grid arrays and associated systems and methods | David K. Ovard, Thomas Hein, Timothy M. Hollis | 2024-05-28 |
| 11670578 | Ball grid arrays and associated apparatuses and systems | David K. Ovard, Thomas Hein, Timothy M. Hollis | 2023-06-06 |
| 10083937 | Semiconductor devices and packages and methods of forming semiconductor device packages | Anthony D. Veches, William R. Stephenson | 2018-09-25 |
| 9502369 | Semiconductor devices and packages | Anthony D. Veches, William R. Stephenson | 2016-11-22 |
| 8299598 | Grid array packages and assemblies including the same | — | 2012-10-30 |
| 8198138 | Methods for providing and using grid array packages | — | 2012-06-12 |
| 8164175 | Stackable semiconductor device assemblies | — | 2012-04-24 |
| RE43112 | Stackable ball grid array package | David J. Corisis, Jerry M. Brooks | 2012-01-17 |
| 8049317 | Grid array packages | — | 2011-11-01 |
| 8035974 | Integrated circuit package support system | David J. Corisis, Terry R. Lee | 2011-10-11 |
| 7894192 | Integrated circuit package support system | David J. Corisis, Terry R. Lee | 2011-02-22 |
| 7871859 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Warren M. Farnworth, Terry R. Lee | 2011-01-18 |
| 7829991 | Stackable ceramic FBGA for high thermal applications | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2010-11-09 |
| 7663224 | Semiconductor BGA package having a segmented voltage plane | Michael W. Morrison, Corey Jacobsen | 2010-02-16 |
| 7600314 | Methods for installing a plurality of circuit devices | Larry D. Kinsman, Mike Brooks, Warren M. Farnworth, Terry R. Lee | 2009-10-13 |
| 7569418 | Methods for securing packaged semiconductor devices to carrier substrates | Larry D. Kinsman, Warren M. Farnworth | 2009-08-04 |
| 7501313 | Method of making semiconductor BGA package having a segmented voltage plane | Michael W. Morrison, Corey Jacobsen | 2009-03-10 |
| 7408255 | Assembly for stacked BGA packages | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2008-08-05 |
| 7400032 | Module assembly for stacked BGA packages | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2008-07-15 |
| 7396702 | Module assembly and method for stacked BGA packages | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2008-07-08 |
| 7381591 | Flip-chip adaptor package for bare die | — | 2008-06-03 |
| 7329945 | Flip-chip adaptor package for bare die | — | 2008-02-12 |
| 7285442 | Stackable ceramic FBGA for high thermal applications | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2007-10-23 |