Issued Patents All Time
Showing 25 most recent of 198 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432859 | Surface mount device bonded to an inner layer of a multi-layer substrate | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hong Wan Ng | 2025-09-30 |
| 12243807 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo | 2025-03-04 |
| 11942460 | Systems and methods for reducing the size of a semiconductor assembly | Hong Wan Ng, Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye | 2024-03-26 |
| 11929351 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hong Wan Ng | 2024-03-12 |
| 11908833 | Overlapping die stacks for nand package architecture | Enyong Tai, Li-Ping Wang, Hong Wan Ng | 2024-02-20 |
| 11894289 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo | 2024-02-06 |
| 11723150 | Surface mount device bonded to an inner layer of a multi-layer substrate | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hong Wan Ng | 2023-08-08 |
| 11562987 | Semiconductor devices with multiple substrates and die stacks | Chin Hui Chong, Hong Wan Ng, Seng Kim Ye, Kelvin Tan Aik Boo | 2023-01-24 |
| 11527459 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Seng Kim Ye, Kelvin Tan Aik Boo | 2022-12-13 |
| 11309281 | Overlapping die stacks for NAND package architecture | Enyong Tai, Li-Ping Wang, Hong Wan Ng | 2022-04-19 |
| 11282811 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Kelvin Tan Aik Boo, Chin Hui Chong, Seng Kim Ye, Hong Wan Ng | 2022-03-22 |
| 11031371 | Semiconductor package and method of fabricating semiconductor package | Chin-Tien Chiu, Tiger Tai, Ken Qian, C C Liao, Gursharan Singh | 2021-06-08 |
| 10930607 | Manufacturing process for separating logic and memory array | Michael Mostovoy, Emilio Yero, Gokul Kumar, Yan Li | 2021-02-23 |
| 10854573 | Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch | Zhongli Ji, Ning Ye, Tong Zhang, Yangming Liu | 2020-12-01 |
| 10818575 | Datacenter 3D solid state drives with matrix cooling | Chin-Tien Chiu, Zhongli Ji | 2020-10-27 |
| 10811386 | Semiconductor device | Chin-Tien Chiu, Gursharan Singh, Fisher Yu, C C Liao | 2020-10-20 |
| 10734354 | Semiconductor device including optically connected wafer stack | Chin-Tien Chiu, Ye Bai, Shineng Ma, Ting-Ping Liu, Binbin Zheng +1 more | 2020-08-04 |
| 10607955 | Heterogeneous fan-out structures for memory devices | Chin-Tien Chiu, Chih-Chin Liao, Weiting Jiang | 2020-03-31 |
| 10522489 | Manufacturing process for separating logic and memory array | Michael Mostovoy, Emilio Yero, Gokul Kumar, Yan Li | 2019-12-31 |
| 10490529 | Angled die semiconductor device | Chin-Tien Chiu | 2019-11-26 |
| 10485125 | Integrated USB connector and memory device | Michael W. Patterson, Nandha Kumar Mohanraj | 2019-11-19 |
| 10381327 | Non-volatile memory system with wide I/O memory die | Venkatesh Ramachandra, Michael Mostovoy, Gokul Kumar, Vinayak Ghatawade | 2019-08-13 |
| 10325881 | Vertical semiconductor device having a stacked die block | Suresh Upadhyayula, Ning Ye, Chin-Tien Chiu, Peng Chen | 2019-06-18 |
| 10249592 | Wire bonded wide I/O semiconductor device | Michael Mostovoy, Gokul Kumar, Ning Ye, Venkatesh Ramachandra, Vinayak Ghatawade +1 more | 2019-04-02 |
| 10242965 | Semiconductor device including interconnected package on package | Chin-Tien Chiu | 2019-03-26 |