Issued Patents All Time
Showing 1–25 of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224248 | Semiconductor wafer and semiconductor dies formed therefrom including grooves along long edges of the semiconductor dies | Jia-Xsing Li, Dongpeng Xue, Huirong Zhang, Guocheng Zhong, Xiaohui Wang +1 more | 2025-02-11 |
| 12154860 | Method of forming a semiconductor device including vertical contact fingers | Zhongli Ji, Ning Ye, Fen Yu | 2024-11-26 |
| 12051660 | Wire bond pad design for compact stacked-die package | Xuyi Yang, Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang | 2024-07-30 |
| 11901260 | Thermoelectric semiconductor device and method of making same | Jiandi Du, Yazhou Zhang, Binbin Zheng, Sundarraj Chandran, Wenbin Qu | 2024-02-13 |
| 11784135 | Semiconductor device including conductive bumps to improve EMI/RFI shielding | Jiandi Du, Binbin Zheng, Rui Guo, Zengyu Zhou, Fen Yu | 2023-10-10 |
| 11749647 | Semiconductor device including vertical wire bonds | Xiaofeng Di, Junrong Yan, CheeKeong Chin, Weili Wang, Xin Lu +4 more | 2023-09-05 |
| 11456279 | Integrated electronic element module, semiconductor package, and method for fabricating the same | Cong Zhang, Xuyi Yang, Qi Deng | 2022-09-27 |
| 11444001 | Thermoelectric semiconductor device and method of making same | Jiandi Du, Yazhou Zhang, Binbin Zheng, Sundarraj Chandran, Wenbin Qu | 2022-09-13 |
| 11425817 | Side contact pads for high-speed memory card | Shineng Ma, Xuyi Yang, Chih-Chin Liao, JinXiang Huang | 2022-08-23 |
| 11393735 | Semiconductor device including reinforced corner supports | Yangming Liu, Ning Ye | 2022-07-19 |
| 11355485 | Semiconductor die and semiconductor package | Yazhou Zhang, Shineng Ma | 2022-06-07 |
| 11302673 | Semiconductor device including vertically stacked semiconductor dies | Xuyi Yang, Cong Zhang | 2022-04-12 |
| 11276669 | High capacity semiconductor device including bifurcated memory module | Xuyi Yang, Shineng Ma, Cong Zhang | 2022-03-15 |
| 11257785 | Multi-module integrated interposer and semiconductor device formed therefrom | Cong Zhang, Xuyi Yang, Yazhou Zhang | 2022-02-22 |
| 11189582 | Wire bond pad design for compact stacked-die package | Xuyi Yang, Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang | 2021-11-30 |
| 11177239 | Semiconductor device including control switches to reduce pin capacitance | Shineng Ma, Chih-Chin Liao, Ye Bai, Yazhou Zhang, Yanwen Bai +1 more | 2021-11-16 |
| 11031372 | Semiconductor device including dummy pull-down wire bonds | Han-Shiao Chen, Chih-Chin Liao | 2021-06-08 |
| 11031371 | Semiconductor package and method of fabricating semiconductor package | Tiger Tai, Ken Qian, C C Liao, Hem Takiar, Gursharan Singh | 2021-06-08 |
| 11031378 | Semiconductor device including high speed heterogeneous integrated controller and cache | Yazhou Zhang, Zengyu Zhou | 2021-06-08 |
| 10872856 | Semiconductor device including through vias in molded columns | Yazhou Zhang, Cong Zhang | 2020-12-22 |
| 10818575 | Datacenter 3D solid state drives with matrix cooling | Zhongli Ji, Hem Takiar | 2020-10-27 |
| 10811386 | Semiconductor device | Hem Takiar, Gursharan Singh, Fisher Yu, C C Liao | 2020-10-20 |
| 10734354 | Semiconductor device including optically connected wafer stack | Ye Bai, Shineng Ma, Ting-Ping Liu, Binbin Zheng, Lei Shi +1 more | 2020-08-04 |
| 10607955 | Heterogeneous fan-out structures for memory devices | Chih-Chin Liao, Weiting Jiang, Hem Takiar | 2020-03-31 |
| 10490529 | Angled die semiconductor device | Hem Takiar | 2019-11-26 |