Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12083715 | Mold compound dispensing system and method | Xianlu Cui, C K Chin, Tao Shi | 2024-09-10 |
| 11901327 | Wire bonding for semiconductor devices | Yang Lei, Xiaofeng Di, Yuyun Lou, Zhonghua Qian | 2024-02-13 |
| 11894343 | Vertical semiconductor device with side grooves | Xianlu Cui, Wei Liu, Zhonghua Qian | 2024-02-06 |
| 11783346 | Blockchain enabled collaborative transaction information processing for a supply chain | Peter Koudal, Benjamin Edward Beckmann, Annarita GIANI, John William Carbone, Joseph James Salvo +3 more | 2023-10-10 |
| 11756932 | Sloped interconnector for stacked die package | Xianlu Cui, CheeKeong Chin, Zhonghua Qian | 2023-09-12 |
| 11749647 | Semiconductor device including vertical wire bonds | Xiaofeng Di, CheeKeong Chin, Weili Wang, Xin Lu, Qi Deng +4 more | 2023-09-05 |
| 11445504 | Method for distributing pilot frequency in massive antenna system | Fangmin XU, Rulong Chu, Xingbao Ou | 2022-09-13 |
| 11289395 | Aperture structure on semiconductor component backside to alleviate delamination in stacked packaging | Chee Keong Chin, Xin Lu | 2022-03-29 |
| 11240486 | Detecting interference in depth images captured using overlapping depth cameras | Bo-Hao Chen, Venkata Sri Krishnakanth Pulla | 2022-02-01 |
| 11177241 | Semiconductor device with top die positioned to reduce die cracking | Jianming Zhang, Min Zhao, Kailei Zhang, Chee Keong Chin, Kim Lee Bock | 2021-11-16 |
| 10681338 | Detecting interference in depth images captured using overlapping depth cameras | Bo-Hao Chen, Venkata Sri Krishnakanth Pulla | 2020-06-09 |
| 10483239 | Semiconductor device including dual pad wire bond interconnection | Xiaofeng Di, Harjashan Veer Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu +1 more | 2019-11-19 |
| 10418334 | Semiconductor device including corner recess | Hang ZHANG, Weili Wang, Kim Lee Bock, Chee Keong Chin, Chong Un Tan +1 more | 2019-09-17 |
| 10283485 | Semiconductor device including conductive bump interconnections | Xiaofeng Di, Chee Keong Chin, Kim Lee Bock, Mingxia Wu | 2019-05-07 |
| 10128218 | Semiconductor device including die bond pads at a die edge | Chee Keong Chin, Chong Un Tan, Ming Xia Wu, Kim Lee Bock, Shrikar Bhagath | 2018-11-13 |
| 10075216 | Method for avoiding downlink interference between indoor DAS system and small base station | Peng Pan, Xin Chen, Yingbiao Yao | 2018-09-11 |
| 9867102 | Method for resisting small base station uplink signal interference of indoor DAS system based on antenna selection | Peng Pan, Xin Chen, Yingbiao Yao | 2018-01-09 |
| 9462694 | Spacer layer for embedding semiconductor die | Weili Wang, Li-Ping Wang, Pradeep Rai, Xin Lu, Jianbin Gu +1 more | 2016-10-04 |