Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901327 | Wire bonding for semiconductor devices | Yang Lei, Yuyun Lou, Zhonghua Qian, Junrong Yan | 2024-02-13 |
| 11749647 | Semiconductor device including vertical wire bonds | Junrong Yan, CheeKeong Chin, Weili Wang, Xin Lu, Qi Deng +4 more | 2023-09-05 |
| 10483239 | Semiconductor device including dual pad wire bond interconnection | Junrong Yan, Harjashan Veer Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu +1 more | 2019-11-19 |
| 10283485 | Semiconductor device including conductive bump interconnections | Junrong Yan, Chee Keong Chin, Kim Lee Bock, Mingxia Wu | 2019-05-07 |