Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483239 | Semiconductor device including dual pad wire bond interconnection | Junrong Yan, Xiaofeng Di, Harjashan Veer Singh, Gokul Kumar, Chee Keong Chin +1 more | 2019-11-19 |
| 10128218 | Semiconductor device including die bond pads at a die edge | Junrong Yan, Chee Keong Chin, Chong Un Tan, Kim Lee Bock, Shrikar Bhagath | 2018-11-13 |