Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798918 | Ball grid array substrate | Muhammad Bashir Bin Mansor, Shivaram Sahadevan, Mickaldass Santanasamy, Muhammad Faizul Mohd Yunus, Chin Koon Tang | 2023-10-24 |
| 11699685 | Non-cure and cure hybrid film-on-die for embedded controller die | Ling Yang, Hui Xu | 2023-07-11 |
| 11195786 | Ball grid array substrate | Muhammad Bashir Bin Mansor, Shivaram Sahadevan, Mickaldass Santanasamy, Muhammad Faizul Mohd Yunus, Chin Koon Tang | 2021-12-07 |
| 10418334 | Semiconductor device including corner recess | Hang ZHANG, Weili Wang, Junrong Yan, Kim Lee Bock, Chee Keong Chin +1 more | 2019-09-17 |
| 10276546 | Semiconductor device with die tilt control | Shuai Wu, Xu Wang, Seanan Wang, Peng Lu, Li-Ping Wang | 2019-04-30 |
| 10128218 | Semiconductor device including die bond pads at a die edge | Junrong Yan, Chee Keong Chin, Ming Xia Wu, Kim Lee Bock, Shrikar Bhagath | 2018-11-13 |
| 6864423 | Bump chip lead frame and package | Aik Chong Tan, Chee Chuan Chew | 2005-03-08 |