Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177241 | Semiconductor device with top die positioned to reduce die cracking | Junrong Yan, Jianming Zhang, Min Zhao, Kailei Zhang, Chee Keong Chin | 2021-11-16 |
| 10418334 | Semiconductor device including corner recess | Hang ZHANG, Weili Wang, Junrong Yan, Chee Keong Chin, Chong Un Tan +1 more | 2019-09-17 |
| 10283485 | Semiconductor device including conductive bump interconnections | Junrong Yan, Xiaofeng Di, Chee Keong Chin, Mingxia Wu | 2019-05-07 |
| 10128218 | Semiconductor device including die bond pads at a die edge | Junrong Yan, Chee Keong Chin, Chong Un Tan, Ming Xia Wu, Shrikar Bhagath | 2018-11-13 |
| 9773766 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng-Fei Fu, Zhong Lu +7 more | 2017-09-26 |
| 9038264 | Non-uniform vacuum profile die attach tip | Pradeep Rai, Li-Ping Wang, JinXiang Huang, Enyong Tai, Jianhua Wang +1 more | 2015-05-26 |