Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080616 | Reinforced semiconductor device packaging and associated systems and methods | Yeow Chon Ong, Hong Wan Ng | 2024-09-03 |
| 11282746 | Method of manufacturing microelectronic devices, related tools and apparatus | Thiam Chye Lim | 2022-03-22 |
| 10325881 | Vertical semiconductor device having a stacked die block | Ning Ye, Chin-Tien Chiu, Hem Takiar, Peng Chen | 2019-06-18 |
| 10177128 | Semiconductor device including support pillars on solder mask | Chih-Chin Liao, Sung Tan Shih, Ning Ye | 2019-01-08 |
| 9773766 | Semiconductor device including independent film layer for embedding and/or spacing semiconductor die | Ning Ye, Chin-Tien Chiu, Peng-Fei Fu, Zhong Lu, Cheeman Yu +7 more | 2017-09-26 |
| 9761290 | Overheat prevention for annealing non-volatile memory | Navneeth Kankani, Ning Ye, Sarath Puthenthermadam, Deepanshu Dutta | 2017-09-12 |
| 9218953 | Low profile wire bonded USB device | Robert C. Miller, Hem Takiar, Steven T. Sprouse, Ka Ian Yung | 2015-12-22 |
| 8986050 | Connector of a universal serial bus device | Anthony Michael King, Robert C. Miller | 2015-03-24 |
| 8987053 | Semiconductor package including flip chip controller at bottom of die stack | Hem Takiar | 2015-03-24 |
| 8947883 | Low profile wire bonded USB device | Robert C. Miller, Hem Takiar, Steven T. Sprouse, Ka Ian Yung | 2015-02-03 |
| 8659133 | Etched surface mount islands in a leadframe package | Bonnie Ming-Yan Chan, Shih-Ping Fan-chiang, Hem Takiar | 2014-02-25 |
| 8637963 | Radiation-shielded semiconductor device | Hem Takiar, Chih-Chin Liao | 2014-01-28 |
| 8637779 | Electronic component including micro balls | Naveen Kini | 2014-01-28 |
| 8575739 | Col-based semiconductor package including electrical connections through a single layer leadframe | Ming-Hsun Lee, Hem Takiar | 2013-11-05 |
| 8373268 | Semiconductor package including flip chip controller at bottom of die stack | Hem Takiar | 2013-02-12 |
| 8022417 | Method of assembling semiconductor devices with LEDS | Hem Takiar | 2011-09-20 |
| 8008132 | Etched surface mount islands in a leadframe package | Bonnie Ming-Yan Chan, Shih-Ping Fan-chiang, Hem Takiar | 2011-08-30 |
| 7867819 | Semiconductor package including flip chip controller at bottom of die stack | Hem Takiar | 2011-01-11 |
| 7812356 | Method of assembling semiconductor devices with LEDS | Hem Takiar | 2010-10-12 |
| 7384817 | Method of assembling semiconductor devices with LEDs | Hem Takiar | 2008-06-10 |
| 7354314 | Electrical connector with grounding pin | Steven T. Sprouse, Ka Ian Yung, Patricio Collantes | 2008-04-08 |
| D524817 | Portable memory storage device | Kevin M. Conley, Sanjay Dave, Michael Alan Morganstern, Wesley G. Brewer, Robert C. Miller +5 more | 2006-07-11 |