Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12309918 | Circuit board having embedded electronic component and method for manufacturing the same | Chen Lin | 2025-05-20 |
| 11852944 | Electrochromic module, camera module, and electronic device | Yen-lin Peng | 2023-12-26 |
| 11736785 | Camera module | — | 2023-08-22 |
| 11573784 | Electronic device for updating on-board data of power off status and electronic device package assembly | Chih-Jen Hou, Hsin-Teng Fu, Shang-Wen Wu, Dee-Lun Tsai | 2023-02-07 |
| 10623646 | Camera system and imaging method of camera system | Yen-lin Peng | 2020-04-14 |
| 9909305 | Composite wall assembly | Chia-Ching Lee, Dong-Ying Su | 2018-03-06 |
| 8575739 | Col-based semiconductor package including electrical connections through a single layer leadframe | Suresh Upadhyayula, Hem Takiar | 2013-11-05 |
| 8097495 | Die package with asymmetric leadframe connection | Chih-Chin Liao, Cheemen Yu, Hem Takiar | 2012-01-17 |
| 7728411 | COL-TSOP with nonconductive material for reducing package capacitance | Cheemen Yu, Hem Takiar | 2010-06-01 |
| 7375415 | Die package with asymmetric leadframe connection | Chih-Chin Liao, Cheemen Yu, Hem Takiar | 2008-05-20 |
| 6861736 | Leadframe-based semiconductor package for multi-media card | Ho-Yi Tsai | 2005-03-01 |
| 6603196 | Leadframe-based semiconductor package for multi-media card | Ho-Yi Tsai | 2003-08-05 |
| 6388313 | Multi-chip module | Chin-Te Chen | 2002-05-14 |