Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9695075 | Fluidized bed reactor for ammonia laden wastewater and method for treating ammonia laden wastewater | Der-Ming Lee, Ming-Kuei Chiang, Keng-Chuan Sung, Chien-Ju Lan, Jih-Gaw Lin +1 more | 2017-07-04 |
| 9670084 | Method for treating wastewater containing tetramethylammonium hydroxide and ammonium nitrogen | Der-Ming Lee, Ming-Kuei Chiang, Keng-Chuan Sung, Chien-Ju Lan, Jih-Gaw Lin +1 more | 2017-06-06 |
| 8721888 | Wastewater treatment method using annularly arranged microorganism carriers | Der-Ming Lee, Ming-Kuei Chiang, Keng-Chuan Sung, Jih-Gaw Lin, Sin-Han Su | 2014-05-13 |
| 7999189 | Circuit board structure and method for fabricating the same | Ke Yang, Hung-Ming Chang | 2011-08-16 |
| 7972513 | Process for treating nitrogenous wastewater with simultaneous autotrophic denitrification, hetertrophic denitrification and COD removal | Der-Ming Lee, Ming-Kuei Chiang, Keng-Chuan Sung, Jih-Gaw Lin, Chih-Cheng Wang | 2011-07-05 |
| 7863731 | Heat-dissipating structure and heat-dissipating semiconductor package having the same | Ke Yang, Chang-Fu Lin | 2011-01-04 |
| 7413553 | Exercising apparatus | — | 2008-08-19 |
| D574285 | Needle for a timepiece | — | 2008-08-05 |
| 7203072 | Heat dissipating structure and semiconductor package with the same | Chang-Fu Lin | 2007-04-10 |
| 6980438 | Semiconductor package with heat dissipating structure | Chien-Ping Huang, Han-Ping Pu, Chang-Fu Lin | 2005-12-27 |
| 6836859 | Method and system for version control in a fault tolerant system | Jerry Berg, Jerry Chu | 2004-12-28 |
| 6818538 | Ball grid array semiconductor package and method of fabricating the same | Kuo-Chu Chiang, Yu-Ting Lai | 2004-11-16 |
| 6703713 | Window-type multi-chip semiconductor package | Wei-Cheng Tseng | 2004-03-09 |
| 6670219 | Method of fabricating a CDBGA package | Ming-Xun Lee | 2003-12-30 |
| 6515361 | Cavity down ball grid array (CD BGA) package | Ming-Xun Lee | 2003-02-04 |
| 6441501 | Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweep | Charles Tseng, Yu-Ting Lai, Chung-Pao Wang | 2002-08-27 |
| 6388313 | Multi-chip module | Ming-Hsun Lee | 2002-05-14 |
| 6264535 | Wafer sawing/grinding process | Shi-Yu Chang, Wen-Ta Tsai | 2001-07-24 |
| 6062279 | Adjusting device for tension adjustment of a transmitting belt of a wood planing machine | — | 2000-05-16 |
| 5988239 | Wood planing machine | — | 1999-11-23 |
| 5904192 | Wood planing machine | — | 1999-05-18 |
| 5507330 | Workpiece feeding device for an edge shaping apparatus | — | 1996-04-16 |
| 5143128 | Table-top planer | — | 1992-09-01 |