Issued Patents All Time
Showing 1–25 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12325489 | Power module of electric assisted bicycle | Chi-Wen Chung, Hung-Wei Lin | 2025-06-10 |
| 11987134 | Speed-command generating unit of electric vehicle, and speed-command generating method used for the same | Chun-Chia Tsao | 2024-05-21 |
| 11479126 | System and method for compensating acceleration of electrical motorbike | Chung-An Hsieh, Hsiang-Hsi Huang, Cheng-Hsien Huang | 2022-10-25 |
| 11289409 | Method for fabricating carrier-free semiconductor package | Yueh-Ying Tsai, Fu Tang, Chun-Chi Ke | 2022-03-29 |
| 11228268 | Electric motor controlling system and vibration suppression method for using the same | Chun-Chia Tsao | 2022-01-18 |
| 10566271 | Carrier-free semiconductor package and fabrication method | Yueh-Ying Tsai, Fu Tang, Chun-Chi Ke | 2020-02-18 |
| 9679826 | Method for fabricating semiconductor package with stator set formed by circuits | — | 2017-06-13 |
| 9425152 | Method for fabricating EMI shielding package structure | Chin-Tsai Yao, Chun-Chi Ke | 2016-08-23 |
| 9390959 | Semiconductor package with stator set formed by circuits | — | 2016-07-12 |
| 9252074 | Heat dissipating device | — | 2016-02-02 |
| 9190387 | Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function | Chin-Tsai Yao, Chun-Chi Ke | 2015-11-17 |
| 9190296 | Fabrication method of semiconductor package without chip carrier | Yueh-Ying Tsai, Fu Tang, Chun-Chi Ke | 2015-11-17 |
| 9177837 | Fabrication method of semiconductor package having electrical connecting structures | Pang-Chun Lin, Chun-Yuan Li, Fu Tang, Chun-Chi Ke | 2015-11-03 |
| 9126214 | Showerhead | Tsan-Hua Huang | 2015-09-08 |
| 9040361 | Chip scale package with electronic component received in encapsulant, and fabrication method thereof | Chiang-Cheng Chang, Chun-Chi Ke, Hsin-Yi Liao, Hsi-Chang Hsu | 2015-05-26 |
| 8981575 | Semiconductor package structure | Pang-Chun Lin, Chun-Yuan Li, Chun-Chi Ke | 2015-03-17 |
| 8975734 | Semiconductor package without chip carrier and fabrication method thereof | Yueh-Ying Tsai, Fu Tang, Chun-Chi Ke | 2015-03-10 |
| 8963298 | EMI shielding package structure and method for fabricating the same | Chin-Tsai Yao, Chun-Chi Ke | 2015-02-24 |
| 8901864 | Driver having dead-time compensation function | Chien-Yu Chi | 2014-12-02 |
| 8873244 | Package structure | Pang-Chun Lin, Hsiao-Jen Hung, Chun-Yuan Li, Chun-Chi Ke | 2014-10-28 |
| 8802507 | Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure | Cheng-Chia Chiang, Chin-Huang Chang, Chih-Ming Huang, Jung-Pin Huang | 2014-08-12 |
| 8736030 | Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same | Chin-Tsai Yao, Chun-Chi Ke | 2014-05-27 |
| 8719993 | Semiconductor equipment | Tsan-Hua Huang, Tsung-Hsun HAN | 2014-05-13 |
| 8716861 | Semiconductor package having electrical connecting structures and fabrication method thereof | Pang-Chun Lin, Chun-Yuan Li, Fu Tang, Chun-Chi Ke | 2014-05-06 |
| 8653661 | Package having MEMS element and fabrication method thereof | Chang-Yueh Chan, Chun-Chi Ke, Shih-Kuang Chiu | 2014-02-18 |