Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455159 | Fabrication method of packaging substrate | Wei Wang, Chin-Chih Hsiao, Kuan-I Cheng, Cheng-Wen Chiu | 2016-09-27 |
| 9362217 | Package on package structure and fabrication method thereof | Wei Wang, Chun-Yuan Li, Shao-Tzu Tang, Ying-Chou Tsai | 2016-06-07 |
| 9318354 | Semiconductor package and fabrication method thereof | Xie-Ren Cheng | 2016-04-19 |
| 9177837 | Fabrication method of semiconductor package having electrical connecting structures | Chun-Yuan Li, Fu Tang, Chien-Ping Huang, Chun-Chi Ke | 2015-11-03 |
| 9171741 | Packaging substrate and fabrication method thereof | Wei Wang, Chin-Chih Hsiao, Kaun-I Cheng, Cheng-Wen Chiu | 2015-10-27 |
| 9029203 | Method of fabricating semiconductor package | Yueh-Ying Tsai, Yong Chen | 2015-05-12 |
| 8981575 | Semiconductor package structure | Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke | 2015-03-17 |
| 8873244 | Package structure | Hsiao-Jen Hung, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke | 2014-10-28 |
| 8716861 | Semiconductor package having electrical connecting structures and fabrication method thereof | Chun-Yuan Li, Fu Tang, Chien-Ping Huang, Chun-Chi Ke | 2014-05-06 |
| 8525336 | Semiconductor package and method of fabricating the same | Yueh-Ying Tsai, Yong Chen | 2013-09-03 |
| 8421199 | Semiconductor package structure | Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke | 2013-04-16 |
| 8390118 | Semiconductor package having electrical connecting structures and fabrication method thereof | Chun-Yuan Li, Fu Tang, Chien-Ping Huang, Chun-Chi Ke | 2013-03-05 |
| 8304268 | Fabrication method of semiconductor package structure | Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke | 2012-11-06 |
| 7934313 | Package structure fabrication method | Hsiao-Jen Hung, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke | 2011-05-03 |