Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362217 | Package on package structure and fabrication method thereof | Pang-Chun Lin, Wei Wang, Shao-Tzu Tang, Ying-Chou Tsai | 2016-06-07 |
| 9177837 | Fabrication method of semiconductor package having electrical connecting structures | Pang-Chun Lin, Fu Tang, Chien-Ping Huang, Chun-Chi Ke | 2015-11-03 |
| 9130064 | Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier | Chang-Yueh Chan, Chih-Ming Huang, Chih-Hsin Lai | 2015-09-08 |
| 8981575 | Semiconductor package structure | Pang-Chun Lin, Chien-Ping Huang, Chun-Chi Ke | 2015-03-17 |
| 8873244 | Package structure | Pang-Chun Lin, Hsiao-Jen Hung, Chien-Ping Huang, Chun-Chi Ke | 2014-10-28 |
| 8716861 | Semiconductor package having electrical connecting structures and fabrication method thereof | Pang-Chun Lin, Fu Tang, Chien-Ping Huang, Chun-Chi Ke | 2014-05-06 |
| 8618641 | Leadframe-based semiconductor package | Chang-Yueh Chan, Chih-Ming Huang, Chih-Hsin Lai | 2013-12-31 |
| 8421199 | Semiconductor package structure | Pang-Chun Lin, Chien-Ping Huang, Chun-Chi Ke | 2013-04-16 |
| 8390118 | Semiconductor package having electrical connecting structures and fabrication method thereof | Pang-Chun Lin, Fu Tang, Chien-Ping Huang, Chun-Chi Ke | 2013-03-05 |
| 8304268 | Fabrication method of semiconductor package structure | Pang-Chun Lin, Chien-Ping Huang, Chun-Chi Ke | 2012-11-06 |
| 7934313 | Package structure fabrication method | Pang-Chun Lin, Hsiao-Jen Hung, Chien-Ping Huang, Chun-Chi Ke | 2011-05-03 |
| 7314820 | Carrier-free semiconductor package and fabrication method thereof | Yu-Wei Lin, Fu Tang, Terry T. Tsai, Yu-Ting Ho | 2008-01-01 |
| 7230323 | Ground-enhanced semiconductor package and lead frame for the same | Yi-Shiung Lee, Holman Chen, Shih-Tsun Huang, Chih-Yung Yun | 2007-06-12 |
| 7126229 | Wire-bonding method and semiconductor package using the same | Chin-Teng Hsu, Ming-Chun Laio, Holman Chen, Fu Tang | 2006-10-24 |