Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9254994 | Package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Hsin-Yi Liao, Chun-Chi Ke | 2016-02-09 |
| 9130064 | Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier | Chih-Ming Huang, Chun-Yuan Li, Chih-Hsin Lai | 2015-09-08 |
| 8866236 | Package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Hsin-Yi Liao, Chun-Chi Ke | 2014-10-21 |
| 8716070 | Fabrication method of package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Hsin-Yi Liao, Chun-Chi Ke | 2014-05-06 |
| 8653661 | Package having MEMS element and fabrication method thereof | Chien-Ping Huang, Chun-Chi Ke, Shih-Kuang Chiu | 2014-02-18 |
| 8618641 | Leadframe-based semiconductor package | Chih-Ming Huang, Chun-Yuan Li, Chih-Hsin Lai | 2013-12-31 |
| 8564115 | Package structure having micro-electromechanical element | Chien-Ping Huang, Chun-Chi Ke, Chun-An Huang, Chih-Ming Huang | 2013-10-22 |
| 8471284 | LED package structure and fabrication method thereof | Chieh-Lung Lai, Chih-Sheng Hsu | 2013-06-25 |
| 8420430 | Fabrication method of package structure having MEMS element | Chi-Hsin Chiu, Chih-Ming Huang, Hsin-Yi Liao, Chun-Chi Ke | 2013-04-16 |
| 8198689 | Package structure having micro-electromechanical element and fabrication method thereof | Chien-Ping Huang, Chun-Chi Ke, Chun-An Huang, Chih-Ming Huang | 2012-06-12 |
| 8154115 | Package structure having MEMS element and fabrication method thereof | Chien-Ping Huang, Chun-Chi Ke, Shih-Kuang Chiu | 2012-04-10 |
| 7858446 | Sensor-type semiconductor package and fabrication method thereof | Chien-Ping Huang, Tse-Wen Chang, Cheng-Yi Chang | 2010-12-28 |