Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9487393 | Fabrication method of wafer level package having a pressure sensor | Hong-Da Chang, Hsin-Yi Liao, Shih-Kuang Chiu, Chien-An Chen | 2016-11-08 |
| 9133021 | Wafer level package having a pressure sensor and fabrication method thereof | Hong-Da Chang, Hsin-Yi Liao, Shih-Kuang Chiu, Chien-An Chen | 2015-09-15 |
| 8741693 | Method for manufacturing package structure with micro-electromechanical element | Hsin-Yi Liao, Shih-Kuang Chiu | 2014-06-03 |
| 8610272 | Package structure with micro-electromechanical element and manufacturing method thereof | Hsin-Yi Liao, Shih-Kuang Chiu | 2013-12-17 |
| 8564115 | Package structure having micro-electromechanical element | Chang-Yueh Chan, Chien-Ping Huang, Chun-Chi Ke, Chih-Ming Huang | 2013-10-22 |
| 8288189 | Package structure having MEMS element and fabrication method thereof | Hsin-Yi Liao, Shih-Kuang Chiu | 2012-10-16 |
| 8198689 | Package structure having micro-electromechanical element and fabrication method thereof | Chang-Yueh Chan, Chien-Ping Huang, Chun-Chi Ke, Chih-Ming Huang | 2012-06-12 |