Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176327 | Method for fabricating electronic package | Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin | 2024-12-24 |
| 11676948 | Method for fabricating electronic package | Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin | 2023-06-13 |
| 11056470 | Electronic package and method for fabricating the same | Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin | 2021-07-06 |
| 10950507 | Electrical testing method of interposer | Lu-Yi Chen, Shih-Kuang Chiu | 2021-03-16 |
| 10615055 | Method for fabricating package structure | Shih-Kuang Chiu | 2020-04-07 |
| 10199239 | Package structure and fabrication method thereof | Shih-Kuang Chiu | 2019-02-05 |
| 9991178 | Interposer and electrical testing method thereof | Lu-Yi Chen, Shih-Kuang Chiu | 2018-06-05 |
| 9520304 | Semiconductor package and fabrication method thereof | Hong-Da Chang, Yi-Che Lai, Shih-Kuang Chiu | 2016-12-13 |
| 9254994 | Package structure having MEMS element | Chih-Ming Huang, Chang-Yueh Chan, Hsin-Yi Liao, Chun-Chi Ke | 2016-02-09 |
| 8866236 | Package structure having MEMS element | Chih-Ming Huang, Chang-Yueh Chan, Hsin-Yi Liao, Chun-Chi Ke | 2014-10-21 |
| 8716070 | Fabrication method of package structure having MEMS element | Chih-Ming Huang, Chang-Yueh Chan, Hsin-Yi Liao, Chun-Chi Ke | 2014-05-06 |
| 8520391 | Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof | Huei-Nuan Huang, Pin-Cheng Huang, Chun-Hung Lu, Chun-Chieh Chao | 2013-08-27 |
| 8420430 | Fabrication method of package structure having MEMS element | Chih-Ming Huang, Chang-Yueh Chan, Hsin-Yi Liao, Chun-Chi Ke | 2013-04-16 |