Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8520391 | Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof | Pin-Cheng Huang, Chun-Hung Lu, Chun-Chieh Chao, Chi-Hsin Chiu | 2013-08-27 |