Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9720013 | Method of fabricating a semiconductor package | Yi-Che Lai | 2017-08-01 |
| 8987012 | Method of testing a semiconductor package | Chun-Tang Lin, Wen-Tsung Tseng, Yi-Che Lai | 2015-03-24 |
| 8520391 | Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof | Huei-Nuan Huang, Chun-Hung Lu, Chun-Chieh Chao, Chi-Hsin Chiu | 2013-08-27 |