Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205906 | Electronic package and fabrication method thereof | Yu-Lung Huang, Yuan-Hung Hsu, Chi-Jen Chen | 2025-01-21 |
| 12176327 | Method for fabricating electronic package | Kong-Toon Ng, Hung-Ho Lee, Chang-Fu Lin, Chi-Hsin Chiu | 2024-12-24 |
| 12100642 | Electronic package and fabrication method thereof | Yu-Lung Huang, Chang-Fu Lin, Yuan-Hung Hsu | 2024-09-24 |
| 11881459 | Electronic package and fabrication method thereof | Yu-Lung Huang, Yuan-Hung Hsu, Chi-Jen Chen | 2024-01-23 |
| 11792938 | Method for fabricating carrier structure | Yu-Lung Huang, Chang-Fu Lin, Yuan-Hung Hsu | 2023-10-17 |
| 11676948 | Method for fabricating electronic package | Kong-Toon Ng, Hung-Ho Lee, Chang-Fu Lin, Chi-Hsin Chiu | 2023-06-13 |
| 11482470 | Electronic package and fabrication method thereof | Yu-Lung Huang, Chang-Fu Lin, Yuan-Hung Hsu | 2022-10-25 |
| 11410954 | Electronic package, manufacturing method thereof and conductive structure | Yu-Lung Huang, Chang-Fu Lin, Yuan-Hung Hsu | 2022-08-09 |
| 11315881 | Electronic package and manufacturing method thereof | Chi-Ching Ho, Bo MA | 2022-04-26 |
| 11289346 | Method for fabricating electronic package | Chen-Yu Huang, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo MA | 2022-03-29 |
| 11069661 | Electronic package | Wei-Jhen Chen, Yu-Lung Huang, Chang-Fu Lin, Yuan-Hung Hsu | 2021-07-20 |
| 11056470 | Electronic package and method for fabricating the same | Kong-Toon Ng, Hung-Ho Lee, Chang-Fu Lin, Chi-Hsin Chiu | 2021-07-06 |
| 10950520 | Electronic package, method for fabricating the same, and heat dissipator | Yu-Lung Huang, Chang-Fu Lin, Kuo-Hua Yu, Wen-Shan Tsai, En-Li Lin +2 more | 2021-03-16 |
| 10863626 | Electronic package carrier structure thereof, and method for fabricating the carrier structure | Yu-Lung Huang, Chang-Fu Lin, Yuan-Hung Hsu | 2020-12-08 |
| 10763237 | Method for manufacturing electronic package | Yu-Min Lo, Chang-Fu Lin, Kuo-Hua Yu, Hsiang-Hua Huang | 2020-09-01 |
| 10741500 | Electronic package | Chen-Yu Huang, Chang-Fu Lin, Kong-Toon Ng, Rui-Feng Tai, Bo MA | 2020-08-11 |
| 10600708 | Electronic package and method for fabricating the same | Wen-Shan Tsai, Chang-Fu Lin | 2020-03-24 |
| 10522500 | Method for manufacturing electronic package | Yu-Min Lo, Chang-Fu Lin, Kuo-Hua Yu, Hsiang-Hua Huang | 2019-12-31 |
| 10361150 | Substrate construction and electronic package including the same | Yu-Min Lo, Han-Hung Chen, Chang-Fu Lin, Fu-Tang Huang | 2019-07-23 |
| 10354891 | Electronic package and method for fabricating the same | Po-Hao Wang, Chih-Jen Yang, Yu-Chih Cheng, Chang-Fu Lin | 2019-07-16 |
| 9887110 | Substrate warpage control using temper glass with uni-directional heating | Takashi Shuto | 2018-02-06 |
| 9754849 | Organic-inorganic hybrid structure for integrated circuit packages | Plory Huang, Henry Su, Ryan Jason Ong, Jones Wang, Daniel Hsieh | 2017-09-05 |
| 7750450 | Stacked die package with stud spacers | Ying-Ren Lin, Nelson Punzalan | 2010-07-06 |
| 7701069 | Solder interface locking using unidirectional growth of an intermetallic compound | Kum Leong, Siew Fong Tai | 2010-04-20 |
| 7692301 | Stitched micro-via to enhance adhesion and mechanical strength | Kum Leong, Kian Sin Sim | 2010-04-06 |