Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7750450 | Stacked die package with stud spacers | Nelson Punzalan, Chee-Key Chung | 2010-07-06 |
| 7348211 | Method for fabricating semiconductor packages | Ho-Yi Tsai, Chien-Ping Huang, Cheng-Hsu Hsiao | 2008-03-25 |
| 7271483 | Bump structure of semiconductor package and method for fabricating the same | Chien-Ping Huang, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2007-09-18 |
| 7180183 | Semiconductor device with reinforced under-support structure and method of fabricating the same | Ho-Yi Tsai, Chin-Ming Shih | 2007-02-20 |
| 7173828 | Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure | Chih-Ming Huang, Ho-Yi Tsai | 2007-02-06 |
| 7129119 | Method for fabricating semiconductor packages | Ho-Yi Tsai, Chien-Ping Huang | 2006-10-31 |
| 6865084 | Thermally enhanced semiconductor package with EMI shielding | Ho-Yi Tsai | 2005-03-08 |