Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679932 | Semiconductor package and a substrate for packaging | Chang-Fu Lin, Chin-Tsai Yao | 2020-06-09 |
| 9666453 | Semiconductor package and a substrate for packaging | Chang-Fu Lin, Chin-Tsai Yao | 2017-05-30 |
| 9368467 | Substrate structure and semiconductor package using the same | Chang-Fu Lin, Chin-Tsai Yao | 2016-06-14 |
| 9013042 | Interconnection structure for semiconductor package | Chang-Fu Lin, Chin-Tsai Yao, Jui-Chung Ho, Ching-Hui Hung | 2015-04-21 |
| 8895366 | Fabrication method of semiconductor package | Wen-Home Huang, Wen-Tsung Tseng, Chang-Fu Lin, Cheng-Hsu Hsiao | 2014-11-25 |
| 8698326 | Semiconductor package and fabrication method thereof | Wen-Home Huang, Wen-Tsung Tseng, Chang-Fu Lin, Cheng-Hsu Hsiao | 2014-04-15 |
| 8420521 | Method for fabricating stack structure of semiconductor packages | Fang-Lin Tsai, Han-Ping Pu, Cheng-Hsu Hsiao | 2013-04-16 |
| 8361843 | Method for fabricating heat dissipation package structure | Min-Shun Hung, Chien-Ping Huang, Cheng-Hsu Hsiao | 2013-01-29 |
| 8013443 | Electronic carrier board and package structure thereof | Fang-Lin Tsai, Chih-Ming Huang, Chien-Ping Huang | 2011-09-06 |
| 8008769 | Heat-dissipating semiconductor package structure and method for manufacturing the same | Wen-Tsung Tseng, Chien-Ping Huang, Cheng-Hsu Hsiao | 2011-08-30 |
| 7889511 | Electronic carrier board applicable to surface mount technology | Fang-Lin Tsai, Wen-Tsung Tseng, Chih-Ming Huang | 2011-02-15 |
| 7855443 | Stack structure of semiconductor packages and method for fabricating the stack structure | Fang-Lin Tsai, Han-Ping Pu, Cheng-Hsu Hsiao | 2010-12-21 |
| 7696623 | Electronic carrier board and package structure thereof | Fang-Lin Tsai, Chih-Ming Huang, Chien-Ping Huang | 2010-04-13 |
| 7608915 | Heat dissipation semiconductor package | Chun-Ming Liao, Chien-Ping Huang, Cheng-Hsu Hsiao | 2009-10-27 |
| 7573722 | Electronic carrier board applicable to surface mounted technology (SMT) | Fang-Lin Tsai, Wen-Tsung Tseng, Chih-Ming Huang | 2009-08-11 |
| 7371617 | Method for fabricating semiconductor package with heat sink | Chien-Ping Huang | 2008-05-13 |
| 7348211 | Method for fabricating semiconductor packages | Ying-Ren Lin, Chien-Ping Huang, Cheng-Hsu Hsiao | 2008-03-25 |
| 7271483 | Bump structure of semiconductor package and method for fabricating the same | Ying-Ren Lin, Chien-Ping Huang, Cheng-Hsu Hsiao | 2007-09-18 |
| 7180183 | Semiconductor device with reinforced under-support structure and method of fabricating the same | Chin-Ming Shih, Ying-Ren Lin | 2007-02-20 |
| 7173828 | Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure | Ying-Ren Lin, Chih-Ming Huang | 2007-02-06 |
| 7164210 | Semiconductor package with heat sink and method for fabricating same | Chien-Ping Huang | 2007-01-16 |
| 7129119 | Method for fabricating semiconductor packages | Ying-Ren Lin, Chien-Ping Huang | 2006-10-31 |
| 6865084 | Thermally enhanced semiconductor package with EMI shielding | Ying-Ren Lin | 2005-03-08 |
| 6861736 | Leadframe-based semiconductor package for multi-media card | Ming-Hsun Lee | 2005-03-01 |
| 6781222 | Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof | Chi-Chuan Wu, Chian Ping Huang, Jui-Yu Chuang, Yude Chu | 2004-08-24 |