Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7339280 | Semiconductor package with lead frame as chip carrier and method for fabricating the same | Lien-Chi Chan, Chih-Ming Huang | 2008-03-04 |
| D529031 | IC card type circuit module | Chih-Ming Huang, Chien-Ping Huang, Lien-Chi Chan, Cheng-Hsu Hsiao | 2006-09-26 |
| 6858931 | Heat sink with collapse structure for semiconductor package | Chien-Ping Huang, Chi-Chuan Wu, Lien-Chi Chan | 2005-02-22 |
| 6847104 | Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same | Chien-Ping Huang, Chih-Ming Huang, Lien-Chi Chan | 2005-01-25 |
| 6781222 | Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof | Chi-Chuan Wu, Chian Ping Huang, Ho-Yi Tsai, Yude Chu | 2004-08-24 |
| D492314 | IC card type circuit module | Chih-Ming Huang, Chien-Ping Huang, Lien-Chi Chan, Cheng-Hsu Hsiao | 2004-06-29 |
| 6673690 | Method of mounting a passive component over an integrated circuit package substrate | Chi-Chuan Wu | 2004-01-06 |
| 6538321 | Heat sink with collapse structure and semiconductor package with heat sink | Chien-Ping Huang, Chi-Chuan Wu, Lien-Chi Chan | 2003-03-25 |
| 6483178 | Semiconductor device package structure | — | 2002-11-19 |
| 6472743 | Semiconductor package with heat dissipating structure | Chien-Ping Huang, Chi-Chuan Wu, Lien-Chih Chan, Ming-Chih Hsieh | 2002-10-29 |