Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7781264 | Method for fabricating flip-chip semiconductor package with lead frame as chip carrier | Chien-Ping Huang, Han-Ping Pu | 2010-08-24 |
| 7274088 | Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof | Chien-Ping Huang, Han-Ping Pu | 2007-09-25 |
| 7170168 | Flip-chip semiconductor package with lead frame and method for fabricating the same | Ke Yang | 2007-01-30 |
| 7045395 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2006-05-16 |
| 6951776 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2005-10-04 |
| 6949413 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2005-09-27 |
| 6949414 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2005-09-27 |
| 6933175 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2005-08-23 |
| 6858931 | Heat sink with collapse structure for semiconductor package | Chien-Ping Huang, Jui-Yu Chuang, Lien-Chi Chan | 2005-02-22 |
| 6798054 | Method of packaging multi chip module | Randy H. Y. Lo, Ssu-Cheng LAI | 2004-09-28 |
| 6781222 | Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof | Chian Ping Huang, Jui-Yu Chuang, Ho-Yi Tsai, Yude Chu | 2004-08-24 |
| 6764880 | Semiconductor package and fabricating method thereof | Chien-Ping Huang | 2004-07-20 |
| 6753602 | Semiconductor package with heat-dissipating structure and method of making the same | — | 2004-06-22 |
| 6731015 | Super low profile package with stacked dies | Tzong-Dar Her | 2004-05-04 |
| 6713850 | Tape carrier package structure with dummy pads and dummy leads for package reinforcement | Po-Hao Yuan, Chih-Shun Chen | 2004-03-30 |
| 6673690 | Method of mounting a passive component over an integrated circuit package substrate | Jui-Yu Chuang | 2004-01-06 |
| 6661087 | Lead frame and flip chip semiconductor package with the same | — | 2003-12-09 |
| 6611434 | Stacked multi-chip package structure with on-chip integration of passive component | Randy H. Y. Lo, Tzong-Da Ho | 2003-08-26 |
| 6602737 | Semiconductor package with heat-dissipating structure and method of making the same | — | 2003-08-05 |
| 6593662 | Stacked-die package structure | Han-Ping Pu, Randy H. Y. Lo, Tzong-Dar Her, Chien-Ping Huang, Cheng-Shiu Hsiao | 2003-07-15 |
| 6590281 | Crack-preventive semiconductor package | Chien-Ping Huang | 2003-07-08 |
| 6555902 | Multiple stacked-chip packaging structure | Randy H. Y. Lo, Chien-Ping Huang | 2003-04-29 |
| 6541310 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2003-04-01 |
| 6538321 | Heat sink with collapse structure and semiconductor package with heat sink | Chien-Ping Huang, Jui-Yu Chuang, Lien-Chi Chan | 2003-03-25 |
| 6507120 | Flip chip type quad flat non-leaded package | Randy H. Y. Lo | 2003-01-14 |