Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6593662 | Stacked-die package structure | Han-Ping Pu, Randy H. Y. Lo, Tzong-Dar Her, Chien-Ping Huang, Chi-Chuan Wu | 2003-07-15 |
| 6476469 | Quad flat non-leaded package structure for housing CMOS sensor | Chin-Yuan Hung, Lien-Chen Chiang | 2002-11-05 |