Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6731015 | Super low profile package with stacked dies | Chi-Chuan Wu | 2004-05-04 |
| 6713321 | Super low profile package with high efficiency of heat dissipation | Chien-Ping Huang | 2004-03-30 |
| 6650009 | Structure of a multi chip module having stacked chips | Randy H. Y. Lo, Chien-Ping Huang | 2003-11-18 |
| 6593662 | Stacked-die package structure | Han-Ping Pu, Randy H. Y. Lo, Chien-Ping Huang, Cheng-Shiu Hsiao, Chi-Chuan Wu | 2003-07-15 |
| 6583499 | Quad flat non-leaded package and leadframe for use in a quad flat non-leaded package | Chien-Ping Huang | 2003-06-24 |
| 6541854 | Super low profile package with high efficiency of heat dissipation | Chien-Ping Huang | 2003-04-01 |
| 6525942 | Heat dissipation ball grid array package | Chien-Ping Huang | 2003-02-25 |
| 6391666 | Method for identifying defective elements in array molding of semiconductor packaging | Ya-Hui Huang, Chih-Chin Liao | 2002-05-21 |
| 6392425 | Multi-chip packaging having non-sticking test structure | April Chen, Chih-Chin Liao | 2002-05-21 |
| 6291260 | Crack-preventive substrate and process for fabricating solder mask | Chien-Ping Huang, April Chen | 2001-09-18 |
| 6218731 | Tiny ball grid array package | Chien-Ping Huang, Kevin Chiang | 2001-04-17 |