Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569155 | Substrate bonding pad having a multi-surface trace interface | Cheng-Hsiung Yang | 2023-01-31 |
| 11425817 | Side contact pads for high-speed memory card | Shineng Ma, Xuyi Yang, Chin-Tien Chiu, JinXiang Huang | 2022-08-23 |
| 11234327 | Printed circuit board trace for galvanic effect reduction | Songtao Lu, Cheng-Hsiung Yang, Yuequan Shi, Ye Bai, JinXiang Huang | 2022-01-25 |
| 11177239 | Semiconductor device including control switches to reduce pin capacitance | Shineng Ma, Chin-Tien Chiu, Ye Bai, Yazhou Zhang, Yanwen Bai +1 more | 2021-11-16 |
| 11031372 | Semiconductor device including dummy pull-down wire bonds | Han-Shiao Chen, Chin-Tien Chiu | 2021-06-08 |
| 10607955 | Heterogeneous fan-out structures for memory devices | Chin-Tien Chiu, Weiting Jiang, Hem Takiar | 2020-03-31 |
| 10249587 | Semiconductor device including optional pad interconnect | Han-Shiao Chen | 2019-04-02 |
| 10249592 | Wire bonded wide I/O semiconductor device | Michael Mostovoy, Gokul Kumar, Ning Ye, Hem Takiar, Venkatesh Ramachandra +1 more | 2019-04-02 |
| 10177128 | Semiconductor device including support pillars on solder mask | Sung Tan Shih, Suresh Upadhyayula, Ning Ye | 2019-01-08 |
| 10051733 | Printed circuit board with coextensive electrical connectors and contact pad areas | Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar | 2018-08-14 |
| 9899347 | Wire bonded wide I/O semiconductor device | Michael Mostovoy, Gokul Kumar, Ning Ye, Hem Takiar, Venkatesh Ramachandra +1 more | 2018-02-20 |
| 9230919 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu, Hem Takiar | 2016-01-05 |
| 9209159 | Hidden plating traces | Hem Takiar, Cheeman Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Han-Shiao Chen | 2015-12-08 |
| 9006912 | Printed circuit board with coextensive electrical connectors and contact pad areas | Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheemen Yu, Hem Takiar | 2015-04-14 |
| 8878368 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Ken Jian Ming Wang, Han-Shiao Chen, Cheeman Yu, Hem Takiar | 2014-11-04 |
| 8653653 | High density three dimensional semiconductor die package | Cheeman Yu, Hem Takiar | 2014-02-18 |
| 8637963 | Radiation-shielded semiconductor device | Suresh Upadhyayula, Hem Takiar | 2014-01-28 |
| 8637972 | Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel | Ning Ye, Cheemen Yu, Jack Chang Chien, Hem Takiar | 2014-01-28 |
| 8502375 | Corrugated die edge for stacked die semiconductor package | Cheeman Yu | 2013-08-06 |
| 8487441 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Ken Jian Ming Wang, Han-Shiao Chen, Cheemen Yu, Hem Takiar | 2013-07-16 |
| 8470640 | Method of fabricating stacked semiconductor package with localized cavities for wire bonding | Hem Takiar, Shrikar Bhagath, Cheemen Yu | 2013-06-25 |
| 8461675 | Substrate panel with plating bar structured to allow minimum kerf width | Hem Takiar, Ken Jian Ming Wang, Han-Shiao Chen | 2013-06-11 |
| 8415808 | Semiconductor device with die stack arrangement including staggered die and efficient wire bonding | Cheeman Yu, Ya Huei Lee | 2013-04-09 |
| 8294251 | Stacked semiconductor package with localized cavities for wire bonding | Hem Takiar, Shrikar Bhagath, Cheemen Yu | 2012-10-23 |
| 8217522 | Printed circuit board with coextensive electrical connectors and contact pad areas | Han-Shiao Chen, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar | 2012-07-10 |