Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139277 | Semiconductor device including contact fingers on opposed surfaces | Chien-Te Chen, Cong Zhang, Hsiang Ju Huang, Xuyi Yang, Yu Ying Tan | 2021-10-05 |
| 11031372 | Semiconductor device including dummy pull-down wire bonds | Chih-Chin Liao, Chin-Tien Chiu | 2021-06-08 |
| 10249587 | Semiconductor device including optional pad interconnect | Chih-Chin Liao | 2019-04-02 |
| 10051733 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar | 2018-08-14 |
| 9230919 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar | 2016-01-05 |
| 9209159 | Hidden plating traces | Hem Takiar, Cheeman Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Chih-Chin Liao | 2015-12-08 |
| 9006912 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Chin-Tien Chiu, Ken Jian Ming Wang, Cheemen Yu, Hem Takiar | 2015-04-14 |
| 8878368 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar | 2014-11-04 |
| 8487441 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Cheemen Yu, Hem Takiar | 2013-07-16 |
| 8461675 | Substrate panel with plating bar structured to allow minimum kerf width | Hem Takiar, Ken Jian Ming Wang, Chih-Chin Liao | 2013-06-11 |
| 8217522 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Chin-Tien Chiu, Ken Jian Ming Wang, Cheeman Yu, Hem Takiar | 2012-07-10 |
| 8129272 | Hidden plating traces | Hem Takiar, Cheeman Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Chih-Chin Liao | 2012-03-06 |
| 7967184 | Padless substrate for surface mounted components | Chih-Chin Liao, Ken Jian Ming Wang, Chin-Tien Chiu, Jack Chang Chien, Shrikar Bhagath +2 more | 2011-06-28 |
| 7806731 | Rounded contact fingers on substrate/PCB for crack prevention | Hem Takiar, Cheemen Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Chih-Chin Liao | 2010-10-05 |
| 7746661 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Chin-Tien Chiu, Ken Jian Ming Wang, Cheemen Yu, Hem Takiar | 2010-06-29 |
| 7592699 | Hidden plating traces | Hem Takiar, Cheemen Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Chih-Chin Liao | 2009-09-22 |
| 7538438 | Substrate warpage control and continuous electrical enhancement | Cheemen Yu, Ken Jian Ming Wang, Chin-Tien Chiu, Chih-Chin Liao | 2009-05-26 |
| 7355283 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Ken Jian Ming Wang, Cheemen Yu, Hem Takiar | 2008-04-08 |