Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10605823 | Multiple MEMS device and methods | Sanjay Bhandari, Ben Lee | 2020-03-31 |
| 10051733 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Cheeman Yu, Hem Takiar | 2018-08-14 |
| 9564569 | Hermetic solution for thermal and optical sensor-in-package | Jerome Chandra Bhat, Tian Tian, Seshasayee S. Ankireddi, Kumar Nagaranjan, Seshasayee Gaddamraja | 2017-02-07 |
| 9355968 | Silicon shield for package stress sensitive devices | Ming-Da Cheng, Tian Tian, Mohammad Ayyash, Tuyen Pham, Brian Gregory Rush | 2016-05-31 |
| 9230919 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Han-Shiao Chen, Cheeman Yu, Hem Takiar | 2016-01-05 |
| 9209159 | Hidden plating traces | Hem Takiar, Cheeman Yu, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2015-12-08 |
| 9136258 | Stacked LED for optical sensor devices | Kumar Nagarajan, Seshasayee Gaddamraja | 2015-09-15 |
| 9006912 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Cheemen Yu, Hem Takiar | 2015-04-14 |
| 8878368 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Han-Shiao Chen, Cheeman Yu, Hem Takiar | 2014-11-04 |
| 8487441 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Han-Shiao Chen, Cheemen Yu, Hem Takiar | 2013-07-16 |
| 8461675 | Substrate panel with plating bar structured to allow minimum kerf width | Hem Takiar, Chih-Chin Liao, Han-Shiao Chen | 2013-06-11 |
| 8269321 | Low cost lead frame package and method for forming same | Matthew Kaufmann | 2012-09-18 |
| 8269323 | Integrated circuit package with etched leadframe for package-on-package interconnects | Rezaur Rahman Khan | 2012-09-18 |
| 8217522 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Cheeman Yu, Hem Takiar | 2012-07-10 |
| 8193613 | Semiconductor die having increased usable area | Ming Wang Sze | 2012-06-05 |
| 8129272 | Hidden plating traces | Hem Takiar, Cheeman Yu, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2012-03-06 |
| 7967184 | Padless substrate for surface mounted components | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Jack Chang Chien, Shrikar Bhagath +2 more | 2011-06-28 |
| 7872335 | Lead frame-BGA package with enhanced thermal performance and I/O counts | Rezaur Rahman Khan | 2011-01-18 |
| 7806731 | Rounded contact fingers on substrate/PCB for crack prevention | Hem Takiar, Cheemen Yu, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2010-10-05 |
| 7746661 | Printed circuit board with coextensive electrical connectors and contact pad areas | Chih-Chin Liao, Han-Shiao Chen, Chin-Tien Chiu, Cheemen Yu, Hem Takiar | 2010-06-29 |
| 7618849 | Integrated circuit package with etched leadframe for package-on-package interconnects | Rezaur Rahman Khan | 2009-11-17 |
| 7592699 | Hidden plating traces | Hem Takiar, Cheemen Yu, Chin-Tien Chiu, Han-Shiao Chen, Chih-Chin Liao | 2009-09-22 |
| 7538438 | Substrate warpage control and continuous electrical enhancement | Cheemen Yu, Chin-Tien Chiu, Chih-Chin Liao, Han-Shiao Chen | 2009-05-26 |
| 7355283 | Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging | Chin-Tien Chiu, Chih-Chin Liao, Han-Shiao Chen, Cheemen Yu, Hem Takiar | 2008-04-08 |
| 6412954 | Dust-proof device for solid integration rod in projecting apparatus | — | 2002-07-02 |