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Ball grid array package with improved thermal characteristics |
Neil McLellan, Kwok Cheung Tsang, Wing Keung Lam, Wai Kit Tam |
2016-09-20 |
| 9390993 |
Semiconductor border protection sealant |
Sam Ziqun Zhao, Galen Kirkpatrick, Edward Law, Reza-ur Rahman Khan |
2016-07-12 |
| 8610262 |
Ball grid array package with improved thermal characteristics |
Neil McLellan, Kwok Cheung Tsang, Wing Keung Lam, Wai Kit Tam |
2013-12-17 |
| 8193613 |
Semiconductor die having increased usable area |
Ken Jian Ming Wang |
2012-06-05 |
| 8077439 |
Method and system for mitigating risk of electrostatic discharge for a system on chip (SOC) |
Hooman Darabi, Kent Oertle, Paul Chang |
2011-12-13 |
| 7315080 |
Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader |
Chun Ho Fan, Wing Keung Lam, Sadak Thamby Labeeb, Neil McLellan, Mohan Kirloskar |
2008-01-01 |
| 6987032 |
Ball grid array package and process for manufacturing same |
Chun Ho Fan, Wing Keung Lam, Sadak Thamby Labeeb, Neil McLellan, Mohan Kirloskar |
2006-01-17 |
| 6979594 |
Process for manufacturing ball grid array package |
Chun Ho Fan, Sadak Thamby Labeeb |
2005-12-27 |
| 6818472 |
Ball grid array package |
Chun Ho Fan, Joseph Martin, Tak Sang Yeung |
2004-11-16 |
| 6800948 |
Ball grid array package |
Chun Ho Fan, Joseph Martin, Tak Sang Yeung |
2004-10-05 |
| 6737755 |
Ball grid array package with improved thermal characteristics |
Neil McLellan, Wing Keung Lam, Kin-wai Wong |
2004-05-18 |
| 6586834 |
Die-up tape ball grid array package |
Kwok Cheung Tsang, Wing Keung Lam, Kin-wai Wong |
2003-07-01 |
