Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9449903 | Ball grid array package with improved thermal characteristics | Neil McLellan, Kwok Cheung Tsang, Wing Keung Lam, Wai Kit Tam | 2016-09-20 |
| 9390993 | Semiconductor border protection sealant | Sam Ziqun Zhao, Galen Kirkpatrick, Edward Law, Reza-ur Rahman Khan | 2016-07-12 |
| 8610262 | Ball grid array package with improved thermal characteristics | Neil McLellan, Kwok Cheung Tsang, Wing Keung Lam, Wai Kit Tam | 2013-12-17 |
| 8193613 | Semiconductor die having increased usable area | Ken Jian Ming Wang | 2012-06-05 |
| 8077439 | Method and system for mitigating risk of electrostatic discharge for a system on chip (SOC) | Hooman Darabi, Kent Oertle, Paul Chang | 2011-12-13 |
| 7315080 | Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader | Chun Ho Fan, Wing Keung Lam, Sadak Thamby Labeeb, Neil McLellan, Mohan Kirloskar | 2008-01-01 |
| 6987032 | Ball grid array package and process for manufacturing same | Chun Ho Fan, Wing Keung Lam, Sadak Thamby Labeeb, Neil McLellan, Mohan Kirloskar | 2006-01-17 |
| 6979594 | Process for manufacturing ball grid array package | Chun Ho Fan, Sadak Thamby Labeeb | 2005-12-27 |
| 6818472 | Ball grid array package | Chun Ho Fan, Joseph Martin, Tak Sang Yeung | 2004-11-16 |
| 6800948 | Ball grid array package | Chun Ho Fan, Joseph Martin, Tak Sang Yeung | 2004-10-05 |
| 6737755 | Ball grid array package with improved thermal characteristics | Neil McLellan, Wing Keung Lam, Kin-wai Wong | 2004-05-18 |
| 6586834 | Die-up tape ball grid array package | Kwok Cheung Tsang, Wing Keung Lam, Kin-wai Wong | 2003-07-01 |