Issued Patents All Time
Showing 1–25 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431398 | Interconnection array device with support | — | 2025-09-30 |
| 12431402 | Stress and warpage improvements for stiffener ring package with exposed die(s) | — | 2025-09-30 |
| 12191243 | Cantilevered power planes to provide a return current path for high-speed signals | Arun Ramakrishnan, Dharmendra Saraswat, Reza Sharifi, Sam Karikalan, Mayank Mayukh +1 more | 2025-01-07 |
| 11906802 | Photonics integration in semiconductor packages | Mayank Mayukh, Sam Karikalan, Reza Sharifi, Liming Tsau, Arun Ramakrishnan +1 more | 2024-02-20 |
| 11049829 | Redistribution metal and under bump metal interconnect structures and method | Liming Tsau, Edward Law, Andy Brotman | 2021-06-29 |
| 10615110 | Thin recon interposer package without TSV for fine input/output pitch fan-out | Sam Karikalan, Edward Law, Rezaur Rahman Khan, Pieter Vorenkamp | 2020-04-07 |
| 10504862 | Redistribution metal and under bump metal interconnect structures and method | Liming Tsau, Edward Law, Andy Brotman | 2019-12-10 |
| 10276403 | High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer | Rezaur Rahman Khan | 2019-04-30 |
| 10079191 | Heat spreader having thermal interface material retainment | Rezaur Rahman Khan | 2018-09-18 |
| 10013285 | Locating wireless-enabled components and applications thereof | Arya Behzad, Michael Boers, Jesus Alfonso Castaneda, Ahmadreza Rofougaran | 2018-07-03 |
| 10008439 | Thin recon interposer package without TSV for fine input/output pitch fan-out | Sam Karikalan, Edward Law, Rezaur Rahman Khan, Pieter Vorenkamp | 2018-06-26 |
| 9891951 | Wireless bus for intra-chip and inter-chip communication, including wireless-enabled component (WEC) embodiments | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2018-02-13 |
| 9842827 | Wafer level system in package (SiP) using a reconstituted wafer and method of making | Rezaur Rahman Khan | 2017-12-12 |
| 9837378 | Fan-out 3D IC integration structure without substrate and method of making the same | Rezaur Rahman Khan | 2017-12-05 |
| 9772880 | Wireless bus for intra-chip and inter-chip communication, including adaptive link and route embodiments | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2017-09-26 |
| 9693461 | Magnetic-core three-dimensional (3D) inductors and packaging integration | Edward Law, Sampath Komarapalayam Velayudham Karikalan, Neal Kistler, Rezaur Rahman Khan, Pieter Vorenkamp | 2017-06-27 |
| 9680002 | Semiconductor device with a variable-width vertical channel formed through a plurality of semiconductor layers | Frank Hui | 2017-06-13 |
| 9618560 | Apparatus and method to monitor thermal runaway in a semiconductor device | — | 2017-04-11 |
| 9612871 | Wireless bus for intra-chip and inter-chip communication, including resource borrowing embodiments | Ahmadreza (Reza) Rofougaran, Arya Behzad, Jesus Alfonso Castaneda, Michael Boers | 2017-04-04 |
| 9570420 | Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package | Jesus Alfonso Castaneda, Arya Behzad, Ahmadreza (Reza) Rofougaran, Michael Boers | 2017-02-14 |
| 9548251 | Semiconductor interposer having a cavity for intra-interposer die | Rezaur Rahman Khan, Pieter Vorenkamp, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Xiangdong Chen | 2017-01-17 |
| 9472485 | Hybrid thermal interface material for IC packages with integrated heat spreader | Mehdi Saeidi | 2016-10-18 |
| 9459921 | Creating a system on the fly and applications thereof | Ahmadreza (Reza) Rofougaran, Arya Behzad, Michael Boers, Jesus Alfonso Castaneda | 2016-10-04 |
| 9431370 | Compliant dielectric layer for semiconductor device | Rezaur Rahman Khan | 2016-08-30 |
| 9431371 | Semiconductor package with a bridge interposer | Sampath K. V. Karikalan, Kevin Kunzhong Hu, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen | 2016-08-30 |