KH

Kevin Kunzhong Hu

Broadcom: 12 patents #889 of 9,346Top 10%
📍 Cupertino, CA: #1,362 of 6,989 inventorsTop 20%
🗺 California: #50,852 of 386,348 inventorsTop 15%
Overall (All Time): #417,609 of 4,157,543Top 15%
12
Patents All Time

Issued Patents All Time

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
9548251 Semiconductor interposer having a cavity for intra-interposer die Rezaur Rahman Khan, Sam Ziqun Zhao, Pieter Vorenkamp, Sampath K. V. Karikalan, Xiangdong Chen 2017-01-17
9431371 Semiconductor package with a bridge interposer Sampath K. V. Karikalan, Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen 2016-08-30
9293393 Stacked packaging using reconstituted wafers Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Sampath K. V. Karikalan, Xiangdong Chen 2016-03-22
9275976 System-in-package with integrated socket Sam Ziqun Zhao, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen 2016-03-01
9153507 Semiconductor package with improved testability Sam Ziqun Zhao, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen 2015-10-06
9059179 Semiconductor package with a bridge interposer Sampath K. V. Karikalan, Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen 2015-06-16
9041171 Programmable interposer with conductive particles Sam Ziqun Zhao, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen 2015-05-26
9013041 Semiconductor package with ultra-thin interposer without through-semiconductor vias Sampath K. V. Karikalan, Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen 2015-04-21
8928128 Semiconductor package with integrated electromagnetic shielding Sampath K. V. Karikalan, Sam Ziqun Zhao, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen 2015-01-06
8872321 Semiconductor packages with integrated heat spreaders Sam Ziqun Zhao, Rezaur Rahman Khan, Sampath K. V. Karikalan, Pieter Vorenkamp, Xiangdong Chen 2014-10-28
8791533 Semiconductor package having an interposer configured for magnetic signaling Xiangdong Chen, Sam Ziqun Zhao, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp 2014-07-29
8749072 Semiconductor package with integrated selectively conductive film interposer Sam Ziqun Zhao, Sampath K. V. Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp, Xiangdong Chen 2014-06-10