Issued Patents All Time
Showing 25 most recent of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10615110 | Thin recon interposer package without TSV for fine input/output pitch fan-out | Sam Ziqun Zhao, Sam Karikalan, Edward Law, Pieter Vorenkamp | 2020-04-07 |
| 10276403 | High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer | Sam Ziqun Zhao | 2019-04-30 |
| 10079191 | Heat spreader having thermal interface material retainment | Sam Ziqun Zhao | 2018-09-18 |
| 10008439 | Thin recon interposer package without TSV for fine input/output pitch fan-out | Sam Ziqun Zhao, Sam Karikalan, Edward Law, Pieter Vorenkamp | 2018-06-26 |
| 9842827 | Wafer level system in package (SiP) using a reconstituted wafer and method of making | Sam Ziqun Zhao | 2017-12-12 |
| 9837378 | Fan-out 3D IC integration structure without substrate and method of making the same | Sam Ziqun Zhao | 2017-12-05 |
| 9693461 | Magnetic-core three-dimensional (3D) inductors and packaging integration | Sam Ziqun Zhao, Edward Law, Sampath Komarapalayam Velayudham Karikalan, Neal Kistler, Pieter Vorenkamp | 2017-06-27 |
| 9548251 | Semiconductor interposer having a cavity for intra-interposer die | Sam Ziqun Zhao, Pieter Vorenkamp, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Xiangdong Chen | 2017-01-17 |
| 9431371 | Semiconductor package with a bridge interposer | Sampath K. V. Karikalan, Sam Ziqun Zhao, Kevin Kunzhong Hu, Pieter Vorenkamp, Xiangdong Chen | 2016-08-30 |
| 9431370 | Compliant dielectric layer for semiconductor device | Sam Ziqun Zhao | 2016-08-30 |
| 9406636 | Interposer package-on-package structure | Sam Ziqun Zhao | 2016-08-02 |
| 9338880 | Mutual capacitance and magnetic field distribution control for transmission lines | Sampath Komarapalayam Velayudham Karikalan | 2016-05-10 |
| 9299634 | Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages | Sam Ziqun Zhao | 2016-03-29 |
| 9293393 | Stacked packaging using reconstituted wafers | Kevin Kunzhong Hu, Sam Ziqun Zhao, Pieter Vorenkamp, Sampath K. V. Karikalan, Xiangdong Chen | 2016-03-22 |
| 9287189 | Flexible routing for chip on board applications | Milind S. Bhagavat, Javed Iqbal Sandhu, Teck Yang Tan | 2016-03-15 |
| 9275976 | System-in-package with integrated socket | Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Pieter Vorenkamp, Xiangdong Chen | 2016-03-01 |
| 9236442 | Integration of chips and silicon-based trench capacitors using low parasitic silicon-level connections | Milind S. Bhagavat, Sampath Komarapalayam Velayudham Karikalan | 2016-01-12 |
| 9230875 | Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding | Sam Ziqun Zhao | 2016-01-05 |
| 9153507 | Semiconductor package with improved testability | Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Pieter Vorenkamp, Xiangdong Chen | 2015-10-06 |
| 9129980 | Package 3D interconnection and method of making same | Sam Ziqun Zhao | 2015-09-08 |
| 9070627 | Interposer package-on-package structure | Sam Ziqun Zhao | 2015-06-30 |
| 9064781 | Package 3D interconnection and method of making same | Sam Ziqun Zhao | 2015-06-23 |
| 9059179 | Semiconductor package with a bridge interposer | Sampath K. V. Karikalan, Sam Ziqun Zhao, Kevin Kunzhong Hu, Pieter Vorenkamp, Xiangdong Chen | 2015-06-16 |
| 9041171 | Programmable interposer with conductive particles | Sam Ziqun Zhao, Kevin Kunzhong Hu, Sampath K. V. Karikalan, Pieter Vorenkamp, Xiangdong Chen | 2015-05-26 |
| 9024436 | Thermal interface material for integrated circuit package | Sam Ziqun Zhao, Arpit Mittal | 2015-05-05 |