| 11049829 |
Redistribution metal and under bump metal interconnect structures and method |
Sam Ziqun Zhao, Liming Tsau, Andy Brotman |
2021-06-29 |
|
| 10615110 |
Thin recon interposer package without TSV for fine input/output pitch fan-out |
Sam Ziqun Zhao, Sam Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp |
2020-04-07 |
|
| 10504862 |
Redistribution metal and under bump metal interconnect structures and method |
Sam Ziqun Zhao, Liming Tsau, Andy Brotman |
2019-12-10 |
|
| 10008439 |
Thin recon interposer package without TSV for fine input/output pitch fan-out |
Sam Ziqun Zhao, Sam Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp |
2018-06-26 |
$113,151,000 |
| 9693461 |
Magnetic-core three-dimensional (3D) inductors and packaging integration |
Sam Ziqun Zhao, Sampath Komarapalayam Velayudham Karikalan, Neal Kistler, Rezaur Rahman Khan, Pieter Vorenkamp |
2017-06-27 |
$38,891,000 |
| 9564391 |
Thermal enhanced package using embedded substrate |
Kevin Hu |
2017-02-07 |
|
| 9390993 |
Semiconductor border protection sealant |
Sam Ziqun Zhao, Galen Kirkpatrick, Reza-ur Rahman Khan, Ming Wang Sze |
2016-07-12 |
|
| 8957694 |
Wafer level package resistance monitor scheme |
Kunzhong Hu, Chonghua Zhong |
2015-02-17 |
$5,270,000 |
| 8945991 |
Fabricating a wafer level semiconductor package having a pre-formed dielectric layer |
Kevin Hu, Chonghua Zhong |
2015-02-03 |
$5,539,000 |
| 8922014 |
Wafer level semiconductor package |
Kevin Hu, Chonghua Zhong |
2014-12-30 |
$4,929,000 |
| 8779598 |
Method and apparatuses for integrated circuit substrate manufacture |
Fan Yeung, Raymond Tsang |
2014-07-15 |
$9,003,000 |
| 8686558 |
Thermally and electrically enhanced ball grid array package |
Sam Ziqun Zhao, Reza-ur Rahman Khan, Marc Papageorge |
2014-04-01 |
$4,041,000 |
| 8592259 |
Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer |
Kevin Hu, Chonghua Zhong |
2013-11-26 |
$5,420,000 |
| 8587123 |
Multi-chip and multi-substrate reconstitution based packaging |
Kevin Hu, Rezaur Rahman Khan |
2013-11-19 |
$3,691,000 |
| 8367475 |
Chip scale package assembly in reconstitution panel process format |
Rezaur Rahman Khan, Edmund Law |
2013-02-05 |
$4,643,000 |
| 8169067 |
Low profile ball grid array (BGA) package with exposed die and method of making same |
Sam Ziqun Zhao, Rezaur Rahman Khan |
2012-05-01 |
$2,857,000 |
| 8088647 |
Bumping free flip chip process |
Kunzhong Hu |
2012-01-03 |
$2,839,000 |
| 8039949 |
Ball grid array package having one or more stiffeners |
Sam Ziqun Zhao, Rezaur Rahman Khan, Marc Papageorge |
2011-10-18 |
$5,208,000 |
| 7629681 |
Ball grid array package with patterned stiffener surface and method of assembling the same |
Sam Ziqun Zhao, Reza-ur Rahman Khan, Marc Papageorge |
2009-12-08 |
$6,120,000 |
| 7259445 |
Thermal enhanced package for block mold assembly |
Daniel Lau |
2007-08-21 |
|
| 7091469 |
Packaging for optoelectronic devices |
Dean Paul Kossives, Kambhampati Ramakrishna, Diane Sahakian, Theodore G. Tessier, Jamin Ling |
2006-08-15 |
$1,428,000 |
| 6882042 |
Thermally and electrically enhanced ball grid array packaging |
Sam Ziqun Zhao, Reaz-ur Rahman Khan, Marc Papageorge |
2005-04-19 |
$5,511,000 |
