Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049829 | Redistribution metal and under bump metal interconnect structures and method | Sam Ziqun Zhao, Liming Tsau, Andy Brotman | 2021-06-29 |
| 10615110 | Thin recon interposer package without TSV for fine input/output pitch fan-out | Sam Ziqun Zhao, Sam Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp | 2020-04-07 |
| 10504862 | Redistribution metal and under bump metal interconnect structures and method | Sam Ziqun Zhao, Liming Tsau, Andy Brotman | 2019-12-10 |
| 10008439 | Thin recon interposer package without TSV for fine input/output pitch fan-out | Sam Ziqun Zhao, Sam Karikalan, Rezaur Rahman Khan, Pieter Vorenkamp | 2018-06-26 |
| 9693461 | Magnetic-core three-dimensional (3D) inductors and packaging integration | Sam Ziqun Zhao, Sampath Komarapalayam Velayudham Karikalan, Neal Kistler, Rezaur Rahman Khan, Pieter Vorenkamp | 2017-06-27 |
| 9564391 | Thermal enhanced package using embedded substrate | Kevin Hu | 2017-02-07 |
| 9390993 | Semiconductor border protection sealant | Sam Ziqun Zhao, Galen Kirkpatrick, Reza-ur Rahman Khan, Ming Wang Sze | 2016-07-12 |
| 8957694 | Wafer level package resistance monitor scheme | Kunzhong Hu, Chonghua Zhong | 2015-02-17 |
| 8945991 | Fabricating a wafer level semiconductor package having a pre-formed dielectric layer | Kevin Hu, Chonghua Zhong | 2015-02-03 |
| 8922014 | Wafer level semiconductor package | Kevin Hu, Chonghua Zhong | 2014-12-30 |
| 8779598 | Method and apparatuses for integrated circuit substrate manufacture | Fan Yeung, Raymond Tsang | 2014-07-15 |
| 8686558 | Thermally and electrically enhanced ball grid array package | Sam Ziqun Zhao, Reza-ur Rahman Khan, Marc Papageorge | 2014-04-01 |
| 8592259 | Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer | Kevin Hu, Chonghua Zhong | 2013-11-26 |
| 8587123 | Multi-chip and multi-substrate reconstitution based packaging | Kevin Hu, Rezaur Rahman Khan | 2013-11-19 |
| 8367475 | Chip scale package assembly in reconstitution panel process format | Rezaur Rahman Khan, Edmund Law | 2013-02-05 |
| 8169067 | Low profile ball grid array (BGA) package with exposed die and method of making same | Sam Ziqun Zhao, Rezaur Rahman Khan | 2012-05-01 |
| 8088647 | Bumping free flip chip process | Kunzhong Hu | 2012-01-03 |
| 8039949 | Ball grid array package having one or more stiffeners | Sam Ziqun Zhao, Rezaur Rahman Khan, Marc Papageorge | 2011-10-18 |
| 7629681 | Ball grid array package with patterned stiffener surface and method of assembling the same | Sam Ziqun Zhao, Reza-ur Rahman Khan, Marc Papageorge | 2009-12-08 |
| 7259445 | Thermal enhanced package for block mold assembly | Daniel Lau | 2007-08-21 |
| 7091469 | Packaging for optoelectronic devices | Dean Paul Kossives, Kambhampati Ramakrishna, Diane Sahakian, Theodore G. Tessier, Jamin Ling | 2006-08-15 |
| 6882042 | Thermally and electrically enhanced ball grid array packaging | Sam Ziqun Zhao, Reaz-ur Rahman Khan, Marc Papageorge | 2005-04-19 |