Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8367475 | Chip scale package assembly in reconstitution panel process format | Edward Law, Rezaur Rahman Khan | 2013-02-05 |
| 8237262 | Method and system for innovative substrate/package design for a high performance integrated circuit chipset | — | 2012-08-07 |
| 7867816 | Method and system for innovative substrate/package design for a high performance integrated circuit chipset | — | 2011-01-11 |
| 7858402 | Integrated circuit package having reversible ESD protection | — | 2010-12-28 |