Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8581375 | Leadframe-based mold array package heat spreader and fabrication method therefor | Diane Sahakian, Il Kwon Shim | 2013-11-12 |
| 8558399 | Dual molded multi-chip package system | Il Kwon Shim, Seng Guan Chow | 2013-10-15 |
| 8395251 | Integrated circuit package to package stacking system | Il Kwon Shim, Seng Guan Chow, Jeffrey D. Punzalan, Byung Joon Han | 2013-03-12 |
| 8309397 | Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof | Il Kwon Shim, Byung Joon Han, Seng Guan Chow | 2012-11-13 |
| 8211753 | Leadframe-based mold array package heat spreader and fabrication method therefor | Diane Sahakian, Il Kwon Shim | 2012-07-03 |
| 8178982 | Dual molded multi-chip package system | Il Kwon Shim, Seng Guan Chow | 2012-05-15 |
| 8106496 | Semiconductor packaging system with stacking and method of manufacturing thereof | Il Kwon Shim, Seng Guan Chow | 2012-01-31 |
| 8050047 | Integrated circuit package system with flexible substrate and recessed package | Seng Guan Chow, Il Kwon Shim, Byung Joon Han | 2011-11-01 |
| 8031475 | Integrated circuit package system with flexible substrate and mounded package | Seng Guan Chow, Il Kwon Shim, Byung Joon Han | 2011-10-04 |
| 8021924 | Encapsulant cavity integrated circuit package system and method of fabrication thereof | Il Kwon Shim, Byung Joon Han, Seng Guan Chow | 2011-09-20 |
| 7863730 | Array-molded package heat spreader and fabrication method therefor | Il Kwon Shim, Diane Sahakian, Seng Guan Chow, Dario S. Filoteo, Jr., Virgil Ararao | 2011-01-04 |
| 7855100 | Integrated circuit package system with an encapsulant cavity and method of fabrication thereof | Il Kwon Shim, Byung Joon Han, Seng Guan Chow | 2010-12-21 |
| 7795078 | Leadframe package for MEMS microphone assembly | Seng Guan Chow | 2010-09-14 |
| 7790504 | Integrated circuit package system | Byung Joon Han, Seng Guan Chow | 2010-09-07 |
| 7622800 | Stacked semiconductor packages and method therefor | Il Kwon Shim, Seng Guan Chow | 2009-11-24 |
| 7595551 | Semiconductor package for a large die | — | 2009-09-29 |
| 7550828 | Leadframe package for MEMS microphone assembly | Seng Guan Chow | 2009-06-23 |
| 7429787 | Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides | Marcos Karnezos, Il Kwon Shim, Byung Joon Han, Seng Guan Chow | 2008-09-30 |
| 7399658 | Pre-molded leadframe and method therefor | Il Kwon Shim, Diane Sahakian, Seng Guan Chow | 2008-07-15 |
| 7372141 | Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides | Marcos Karnezos, Il Kwon Shim, Byung Joon Han, Seng Guan Chow | 2008-05-13 |
| 7364945 | Method of mounting an integrated circuit package in an encapsulant cavity | Il Kwon Shim, Byung Joon Han, Seng Guan Chow | 2008-04-29 |
| 7309913 | Stacked semiconductor packages | Il Kwon Shim, Seng Guan Chow, Byung Joon Han | 2007-12-18 |
| 7242091 | Stacked semiconductor packages and method therefor | Il Kwon Shim, Seng Guan Chow | 2007-07-10 |
| 7091469 | Packaging for optoelectronic devices | Dean Paul Kossives, Edward Law, Diane Sahakian, Theodore G. Tessier, Jamin Ling | 2006-08-15 |
| 6927479 | Method of manufacturing a semiconductor package for a die larger than a die pad | — | 2005-08-09 |