Issued Patents All Time
Showing 25 most recent of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12302657 | Semiconductor device and method of forming an optical semiconductor package with a shield structure | Emmanuel Espiritu, Il Kwon Shim, Teddy Joaquin Carreon | 2025-05-13 |
| 12211863 | Reliable semiconductor packages | Il Kwon Shim, Emmanuel Espiritu, Allan P. Ilagan, Teddy Joaquin Carreon | 2025-01-28 |
| 12166050 | Reliable semiconductor packages | Il Kwon Shim | 2024-12-10 |
| 12100719 | Reliable semiconductor packages | Il Kwon Shim | 2024-09-24 |
| 11881494 | Semiconductor package with dams | Il Kwon Shim | 2024-01-23 |
| 11670521 | Reliable semiconductor packages for sensor chips | Il Kwon Shim | 2023-06-06 |
| 10109587 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, SeungYong Chai +3 more | 2018-10-23 |
| 9659897 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong | 2017-05-23 |
| 9589876 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan, Dioscoro A. Merilo | 2017-03-07 |
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, SeungYong Chai +3 more | 2016-08-09 |
| 9355983 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong | 2016-05-31 |
| 9305809 | Integrated circuit packaging system with coreless substrate and method of manufacture thereof | Emmanuel Espiritu, Allan P. Ilagan | 2016-04-05 |
| 9129971 | Semiconductor device with bump interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2015-09-08 |
| 8981548 | Integrated circuit package system with relief | Il Kwon Shim, Henry Descalzo Bathan | 2015-03-17 |
| 8803300 | Integrated circuit packaging system with protective coating and method of manufacture thereof | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Emmanuel Espiritu | 2014-08-12 |
| 8698294 | Integrated circuit package system including wide flange leadframe | Zigmund Ramirez Camacho, Jose Alvin Caparas, Arnel Senosa Trasporto | 2014-04-15 |
| 8637394 | Integrated circuit package system with flex bump | Jairus Legaspi Pisigan, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2014-01-28 |
| 8633062 | Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof | Henry Descaizo Bathan, Zigmund Ramirez Camacho, Amel Senosa Trasporto | 2014-01-21 |
| 8633578 | Integrated circuit package system with laminate base | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2014-01-21 |
| 8629537 | Padless die support integrated circuit package system | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2014-01-14 |
| 8546189 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan, Dioscoro A. Merilo | 2013-10-01 |
| 8493748 | Packaging system with hollow package and method for the same | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2013-07-23 |
| 8415778 | Non-leaded integrated circuit package system with multiple ground sites | Byung Tai Do, Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2013-04-09 |
| 8399968 | Non-leaded integrated circuit package system | Henry Descalzo Bathan, Il Kwon Shim | 2013-03-19 |
| 8395251 | Integrated circuit package to package stacking system | Il Kwon Shim, Seng Guan Chow, Byung Joon Han, Kambhampati Ramakrishna | 2013-03-12 |