Issued Patents All Time
Showing 1–25 of 110 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651139 | Semiconductor device and method of forming wafer level ground plane and power ring | Guruprasad G. Badakere, Zigmund Ramirez Camacho | 2020-05-12 |
| RE47923 | Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps | Zigmund Ramirez Camacho, Frederick R. Dahilig, Arnel Senosa Trasporto, Henry Descalzo Bathan | 2020-03-31 |
| 9922955 | Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP | Zigmund Ramirez Camacho, Dioscoro A. Merilo | 2018-03-20 |
| 9666540 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Zigmund Ramirez Camacho, Dioscoro A. Merilo | 2017-05-30 |
| 9589876 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo, Jeffrey D. Punzalan | 2017-03-07 |
| 9525080 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2016-12-20 |
| 9397236 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2016-07-19 |
| 9390991 | Semiconductor device and method of forming wafer level ground plane and power ring | Guruprasad G. Badakere, Zigmund Ramirez Camacho | 2016-07-12 |
| 9337161 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Henry Descalzo Bathan | 2016-05-10 |
| 9257357 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Zigmund Ramirez Camacho, Dioscoro A. Merilo | 2016-02-09 |
| 9252075 | Semiconductor device and method of forming a conductive via-in-via structure | Jianmin Fang, Zigmund Ramirez Camacho | 2016-02-02 |
| 9202777 | Semiconductor package system with cut multiple lead pads | Seng Guan Chow, Zigmund Ramirez Camacho | 2015-12-01 |
| 9142514 | Semiconductor device and method of forming wafer level die integration | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Frederick R. Dahilig | 2015-09-22 |
| 9142531 | Integrated circuit packaging system with plated leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2015-09-22 |
| 9129971 | Semiconductor device with bump interconnection | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2015-09-08 |
| 9076737 | Integrated circuit packaging system with bumps and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Jose Alvin Caparas | 2015-07-07 |
| 9059074 | Integrated circuit package system with planar interconnect | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Abelardo Jr. Hadap Advincula | 2015-06-16 |
| 8957515 | Integrated circuit package system with array of external interconnects | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Abelardo Jr. Hadap Advincula | 2015-02-17 |
| 8941219 | Etched recess package on package system | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jairus Legaspi Pisigan | 2015-01-27 |
| 8940636 | Through hole vias at saw streets including protrusions or recesses for interconnection | Reza A. Pagaila, Zigmund Ramirez Camacho, Byung Tai Do | 2015-01-27 |
| 8937393 | Integrated circuit package system with device cavity | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Frederick R. Dahilig | 2015-01-20 |
| 8921983 | Semiconductor package and method of forming similar structure for top and bottom bonding pads | Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2014-12-30 |
| 8884418 | Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps | Zigmund Ramirez Camacho, Frederick R. Dahilig | 2014-11-11 |
| 8866248 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Arnel Senosa Trasporto | 2014-10-21 |
| 8810017 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Henry Descalzo Bathan | 2014-08-19 |