Issued Patents All Time
Showing 25 most recent of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922955 | Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2018-03-20 |
| 9666540 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2017-05-30 |
| 9589876 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2017-03-07 |
| 9589910 | Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die | Reza A. Pagaila | 2017-03-07 |
| 9406619 | Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die | Reza A. Pagaila, Byung Tai Do | 2016-08-02 |
| 9337161 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2016-05-10 |
| 9293385 | RDL patterning with package on package system | Reza A. Pagaila, Byung Tai Do | 2016-03-22 |
| 9257357 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2016-02-09 |
| 9236352 | Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die | Reza A. Pagaila, Byung Tai Do, Shuangwu Huang, Nathapong Suthiwongsunthorn | 2016-01-12 |
| 9142514 | Semiconductor device and method of forming wafer level die integration | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Frederick R. Dahilig | 2015-09-22 |
| 9064876 | Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP | Reza A. Pagaila, Heap Hoe Kuan | 2015-06-23 |
| 8993376 | Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die | Zigmund Ramirez Camacho, Emmanuel Espiritu, Henry Descalzo Bathan | 2015-03-31 |
| 8890328 | Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Frederick R. Dahilig | 2014-11-18 |
| 8866275 | Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu | 2014-10-21 |
| 8810017 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2014-08-19 |
| 8723324 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu | 2014-05-13 |
| 8722457 | System and apparatus for wafer level integration of components | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2014-05-13 |
| 8617933 | Integrated circuit packaging system with interlock and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu | 2013-12-31 |
| 8546929 | Embedded integrated circuit package-on-package system | You Yang Ong, Seng Guan Chow | 2013-10-01 |
| 8546189 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2013-10-01 |
| 8536692 | Mountable integrated circuit package system with mountable integrated circuit die | Heap Hoe Kuan, Seng Guan Chow, Linda Pei Ee Chua | 2013-09-17 |
| 8525344 | Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor die | Reza A. Pagaila, Byung Tai Do | 2013-09-03 |
| 8518749 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2013-08-27 |
| 8513542 | Integrated circuit leaded stacked package system | Heap Hoe Kuan, Tsz Yin Ho, Seng Guan Chow, Antonio B. Dimaano, Jr. | 2013-08-20 |
| 8502376 | Wirebondless wafer level package with plated bumps and interconnects | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jose Alvin Caparas | 2013-08-06 |