Issued Patents All Time
Showing 26–50 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8435835 | Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die | Reza A. Pagaila | 2013-05-07 |
| 8409922 | Semiconductor device and method of forming leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu | 2013-04-02 |
| 8377750 | Integrated circuit packaging system with multiple row leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan | 2013-02-19 |
| 8304286 | Integrated circuit packaging system with shielded package and method of manufacture thereof | Reza A. Pagaila, Shuangwu Huang | 2012-11-06 |
| 8263434 | Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP | Reza A. Pagaila, Heap Hoe Kuan | 2012-09-11 |
| 8241956 | Semiconductor device and method of forming wafer level multi-row etched lead package | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Emmanuel Espiritu | 2012-08-14 |
| 8241954 | Wafer level die integration and method | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Frederick R. Dahilig | 2012-08-14 |
| 8232658 | Stackable integrated circuit package system with multiple interconnect interface | Seng Guan Chow, Heap Hoe Kuan, Antonio B. Dimaano, Jr. | 2012-07-31 |
| 8216883 | Method for manufacturing semiconductor package system with die support pad | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2012-07-10 |
| 8212342 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2012-07-03 |
| 8193037 | Integrated circuit packaging system with pad connection and method of manufacture thereof | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Emmanuel Espiritu | 2012-06-05 |
| 8178394 | Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof | Antonio B. Dimaano, Jr. | 2012-05-15 |
| 8174127 | Integrated circuit package system employing device stacking | Frederick R. Dahilig, Sheila Marie L. Alvarez, Antonio B. Dimaano, Jr. | 2012-05-08 |
| 8164172 | Integrated circuit package in package system | Tsz Yin Ho, Seng Guan Chow, Antonio B. Dimaanor, Jr., Heap Hoe Kuan | 2012-04-24 |
| 8120187 | Integrated circuit package system employing device stacking and method of manufacture thereof | Frederick R. Dahilig, Sheila Marie L. Alvarez, Antonio B. Dimaano, Jr. | 2012-02-21 |
| 8106500 | Stackable integrated circuit package system | Seng Guan Chow, Heap Hoe Kuan, Antonio B. Dimaano, Jr. | 2012-01-31 |
| 8105915 | Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Frederick R. Dahilig | 2012-01-31 |
| 8097489 | Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die | Reza A. Pagaila, Byung Tai Do | 2012-01-17 |
| 8093151 | Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die | Reza A. Pagaila, Byung Tai Do, Shuangwu Huang, Nathapong Suthiwongsunthorn | 2012-01-10 |
| 8076184 | Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die | Zigmund Ramirez Camacho, Emmanuel Espiritu, Henry Descalzo Bathan | 2011-12-13 |
| 8067832 | Embedded integrated circuit package system and method of manufacture thereof | You Yang Ong, Seng Guan Chow | 2011-11-29 |
| 7985628 | Integrated circuit package system with interconnect lock | Heap Hoe Kuan, Seng Guan Chow, Linda Pei Ee Chua | 2011-07-26 |
| 7986043 | Integrated circuit package on package system | Seng Guan Chow, Antonio B. Dimaano, Jr., Heap Hoe Kuan, Tsz Yin Ho | 2011-07-26 |
| 7981702 | Integrated circuit package in package system | Tsz Yin Ho, Seng Guan Chow, Antonio B. Dimaano, Jr., Heap Hoe Kuan | 2011-07-19 |
| 7964450 | Wirebondless wafer level package with plated bumps and interconnects | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jose Alvin Caparas | 2011-06-21 |