Issued Patents All Time
Showing 1–25 of 159 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12293960 | Side-solderable leadless package | — | 2025-05-06 |
| 12176273 | Semiconductor device and method of forming substrate with 3-sided wettable flank | Yingyu Chen | 2024-12-24 |
| 11810842 | Side-solderable leadless package | — | 2023-11-07 |
| 11469149 | Semiconductor device and method of forming mold degating structure for pre-molded substrate | Zigmund Ramirez Camacho | 2022-10-11 |
| 10892211 | Side-solderable leadless package | — | 2021-01-12 |
| RE47923 | Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps | Zigmund Ramirez Camacho, Frederick R. Dahilig, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2020-03-31 |
| 9721925 | Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2017-08-01 |
| 9589876 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Dioscoro A. Merilo, Jeffrey D. Punzalan | 2017-03-07 |
| 9525080 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2016-12-20 |
| 9472427 | Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2016-10-18 |
| 9397236 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Arnel Senosa Trasporto | 2016-07-19 |
| 9337161 | Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof | Zigmund Ramirez Camacho, Dioscoro A. Merilo, Lionel Chien Hui Tay | 2016-05-10 |
| 9177897 | Integrated circuit packaging system with trace protection layer and method of manufacture thereof | Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2015-11-03 |
| 9142531 | Integrated circuit packaging system with plated leads and method of manufacture thereof | Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2015-09-22 |
| 9129971 | Semiconductor device with bump interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jeffrey D. Punzalan | 2015-09-08 |
| 9059151 | Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu | 2015-06-16 |
| 9059074 | Integrated circuit package system with planar interconnect | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Abelardo Jr. Hadap Advincula | 2015-06-16 |
| 9035440 | Integrated circuit packaging system with a lead and method of manufacture thereof | Emmanuel Espiritu, Elizar Andres, Zigmund Ramirez Camacho | 2015-05-19 |
| 9034692 | Integrated circuit packaging system with a flip chip and method of manufacture thereof | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2015-05-19 |
| 9006031 | Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps | Zigmund Ramirez Camacho, Emmanuel Espiritu | 2015-04-14 |
| 8993376 | Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die | Zigmund Ramirez Camacho, Emmanuel Espiritu, Dioscoro A. Merilo | 2015-03-31 |
| 8981548 | Integrated circuit package system with relief | Il Kwon Shim, Jeffrey D. Punzalan | 2015-03-17 |
| 8957515 | Integrated circuit package system with array of external interconnects | Zigmund Ramirez Camacho, Abelardo Jr. Hadap Advincula, Lionel Chien Hui Tay | 2015-02-17 |
| 8941219 | Etched recess package on package system | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jairus Legaspi Pisigan | 2015-01-27 |
| 8937393 | Integrated circuit package system with device cavity | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Frederick R. Dahilig | 2015-01-20 |