Issued Patents All Time
Showing 1–25 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE47923 | Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps | Zigmund Ramirez Camacho, Frederick R. Dahilig, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2020-03-31 |
| 10068862 | Semiconductor device and method of forming a package in-fan out package | Byung Tai Do | 2018-09-04 |
| 9799589 | Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2017-10-24 |
| 9620480 | Integrated circuit packaging system with unplated leadframe and method of manufacture thereof | Garret Dimaculangan, Linda Pei Ee Chua, Byung Tai Do | 2017-04-11 |
| 9576873 | Integrated circuit packaging system with routable trace and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2017-02-21 |
| 9525080 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2016-12-20 |
| 9449932 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Byung Tai Do, Linda Pei Ee Chua, Reza A. Pagaila | 2016-09-20 |
| 9397236 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2016-07-19 |
| 9368423 | Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package | Byung Tai Do, Linda Pei Ee Chua, Asri Yusof | 2016-06-14 |
| 9324641 | Integrated circuit packaging system with external interconnect and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2016-04-26 |
| 9324584 | Integrated circuit packaging system with transferable trace lead frame | Byung Tai Do, Linda Pei Ee Chua | 2016-04-26 |
| 9312194 | Integrated circuit packaging system with terminals and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2016-04-12 |
| 9305873 | Integrated circuit packaging system with electrical interface and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2016-04-05 |
| 9299644 | Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof | Byung Tai Do, Zigmund Ramirez Camacho | 2016-03-29 |
| 9293351 | Integrated circuit packaging system with planarity control and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua, Emmanuel Espiritu | 2016-03-22 |
| 9219029 | Integrated circuit packaging system with terminals and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2015-12-22 |
| 9190349 | Integrated circuit packaging system with leadframe and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua, Asri Yusof | 2015-11-17 |
| 9177897 | Integrated circuit packaging system with trace protection layer and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua, Henry Descalzo Bathan | 2015-11-03 |
| 9147662 | Integrated circuit packaging system with fiber-less substrate and method of manufacture thereof | Byung Tai Do, Sung-Soo Kim | 2015-09-29 |
| 9142530 | Coreless integrated circuit packaging system and method of manufacture thereof | Byung Tai Do, Sung-Soo Kim, Asri Yusof, In Sang Yoon | 2015-09-22 |
| 9123712 | Leadframe system with warp control mechanism and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2015-09-01 |
| 9105620 | Integrated circuit packaging system with routable traces and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua, Asri Yusof | 2015-08-11 |
| 8987064 | Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2015-03-24 |
| 8963320 | Integrated circuit packaging system with thermal structures and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua, Wei Chun Ang | 2015-02-24 |
| 8957509 | Integrated circuit packaging system with thermal emission and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2015-02-17 |