Issued Patents All Time
Showing 51–75 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8519518 | Integrated circuit packaging system with lead encapsulation and method of manufacture thereof | Byung Tai Do, Reza A. Pagaila, Linda Pei Ee Chua | 2013-08-27 |
| 8513788 | Integrated circuit packaging system with pad and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2013-08-20 |
| 8476772 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Byung Tai Do, Linda Pei Ee Chua, Reza A. Pagaila | 2013-07-02 |
| 8399991 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2013-03-19 |
| 8269324 | Integrated circuit package system with chip on lead | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jose Alvin Caparas | 2012-09-18 |
| 8258609 | Integrated circuit package system with lead support | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jose Alvin Caparas | 2012-09-04 |
| 8252666 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2012-08-28 |
| 8203220 | Integrated circuit package system with multiple device units and method for manufacturing thereof | Lionel Chien Hui Tay, Zigmund Ramirez Camacho, Jeffrey D. Punzalan | 2012-06-19 |
| 8153478 | Method for manufacturing integrated circuit package system with under paddle leadfingers | Guruprasad Badakere Govindaiah | 2012-04-10 |
| 8138027 | Optical semiconductor device having pre-molded leadframe with window and method therefor | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Lionel Chien Hui Tay | 2012-03-20 |
| 8138586 | Integrated circuit package system with multi-planar paddle | Sze Min Wong, Henry Descalzo Bathan, Zigmund Ramirez Camacho | 2012-03-20 |
| 8134242 | Integrated circuit package system with concave terminal | Zigmund Ramirez Camacho, Reza A. Pagaila, Lionel Chien Hui Tay | 2012-03-13 |
| 8120156 | Integrated circuit package system with die on base package | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2012-02-21 |
| 8120149 | Integrated circuit package system | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2012-02-21 |
| 8022514 | Integrated circuit package system with leadfinger support | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jeffrey D. Punzalan | 2011-09-20 |
| 7993939 | Integrated circuit package system with laminate base | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2011-08-09 |
| 7989931 | Integrated circuit package system with under paddle leadfingers | Guruprasad Badakere Govindaiah | 2011-08-02 |
| 7977579 | Multiple flip-chip integrated circuit package system | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Jeffrey D. Punzalan | 2011-07-12 |
| 7977779 | Mountable integrated circuit package-in-package system | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2011-07-12 |
| 7919360 | Integrated circuit packaging system with circuitry stacking and method of manufacture thereof | Zigmund Ramirez Camacho, Jose Alvin Caparas | 2011-04-05 |
| 7919850 | Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof | Lionel Chien Hui Tay, Zigmund Ramirez Camacho, Abelardo Hadap Advincula | 2011-04-05 |
| 7871863 | Integrated circuit package system with multiple molding | Zigmund Ramirez Camacho, Jose Alvin Caparas, Jeffrey D. Punzalan | 2011-01-18 |
| 7868471 | Integrated circuit package-in-package system with leads | Zigmund Ramirez Camacho, Jeffrey D. Punzalan, Abelardo Hadap Advincula | 2011-01-11 |
| 7851246 | Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan | 2010-12-14 |
| 7790576 | Semiconductor device and method of forming through hole vias in die extension region around periphery of die | Henry Descalzo Bathan, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2010-09-07 |