Issued Patents All Time
Showing 1–25 of 192 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688612 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Yaojian Lin, Jun Mo Koo, HeeJo Chi | 2023-06-27 |
| 10998248 | Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die | Yaojian Lin, Jun Mo Koo | 2021-05-04 |
| RE48408 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Seng Guan Chow, Seung Uk Yoon, Byung Tai Do, Linda Pei Ee Chua | 2021-01-26 |
| RE48111 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Seng Guan Chow, Seung Uk Yoon, Byung Tai Do, Linda Pei Ee Chua | 2020-07-21 |
| 10643952 | Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die | Flynn Carson, Seung Uk Yoon | 2020-05-05 |
| 10388584 | Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die | Byung Tai Do, Linda Pei Ee Chua | 2019-08-20 |
| 10068843 | Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die | — | 2018-09-04 |
| 10043733 | Integrated circuit packaging system and method of manufacture thereof | Byung Tai Do, Linda Pei Ee Chua | 2018-08-07 |
| 9893045 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Seng Guan Chow, Seung Uk Yoon, Byung Tai Do, Linda Pei Ee Chua | 2018-02-13 |
| 9875911 | Semiconductor device and method of forming interposer with opening to contain semiconductor die | Yaojian Lin, Jun Mo Koo, HeeJo Chi | 2018-01-23 |
| 9824975 | Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die | Byung Tai Do, Linda Pei Ee Chua | 2017-11-21 |
| 9754858 | Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die | Yaojian Lin, Seung Uk Yoon | 2017-09-05 |
| 9685403 | Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer | — | 2017-06-20 |
| 9679824 | Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP | Rajendra D. Pendse, Jun Mo Koo | 2017-06-13 |
| 9679881 | Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material | Byung Tai Do, Linda Pei Ee Chua | 2017-06-13 |
| 9640504 | Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core | Byung Tai Do, Shuangwu Huang | 2017-05-02 |
| 9620455 | Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure | Yaojian Lin, Jun Mo Koo | 2017-04-11 |
| 9601369 | Semiconductor device and method of forming conductive vias with trench in saw street | Byung Tai Do | 2017-03-21 |
| 9589910 | Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die | Dioscoro A. Merilo | 2017-03-07 |
| 9583446 | Semiconductor device and method of forming a shielding layer between stacked semiconductor die | Byung Tai Do, Nathapong Suthiwongsunthorn | 2017-02-28 |
| 9530738 | Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant | Linda Pei Ee Chua, Byung Tai Do | 2016-12-27 |
| 9508626 | Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height | Yaojian Lin | 2016-11-29 |
| 9484279 | Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die | Flynn Carson, Seung Uk Yoon | 2016-11-01 |
| 9449932 | Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die | Byung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua | 2016-09-20 |
| 9443828 | Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation | Byung Tai Do, Linda Pei Ee Chua | 2016-09-13 |