Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12033276 | Learning-based 3D model creation apparatus and method | Seong Jae Lim, Tae Joon Kim, Seung Wook Lee, Bon Woo Hwang, Jin Sung Choi | 2024-07-09 |
| 11375107 | Apparatus and method for guiding multi-view capture | Seong Jae Lim, Ki-Nam Kim, Tae Joon Kim, Seung Wook Lee, Bon Woo Hwang | 2022-06-28 |
| 11232632 | Learning-based 3D model creation apparatus and method | Seong Jae Lim, Tae Joon Kim, Seung Wook Lee, Bon Woo Hwang, Jin Sung Choi | 2022-01-25 |
| 11138785 | Method and system for generating 3D image of character | Jin Sung Choi, Seung Wook Lee, Tae Joon Kim, Seong Jae Lim, Bon Woo Hwang +1 more | 2021-10-05 |
| RE48408 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Byung Tai Do, Linda Pei Ee Chua | 2021-01-26 |
| 10791263 | Camera auxiliary device for privacy protection and privacy protection method using the same | Bon Woo Hwang, Ki-Nam Kim, Tae Joon Kim, Seung Wook Lee, Seong Jae Lim | 2020-09-29 |
| RE48111 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Byung Tai Do, Linda Pei Ee Chua | 2020-07-21 |
| 10643952 | Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die | Reza A. Pagaila, Flynn Carson | 2020-05-05 |
| 10360313 | Apparatus and method for generating 3D printing model using multiple textures | Seong Jae Lim, Hye Ryeong JUN, Bon Woo Hwang, Chang Joon Park, Jin Sung Choi | 2019-07-23 |
| 10043278 | Method and apparatus for reconstructing 3D face with stereo camera | Kap Kee Kim, Bon Woo Hwang, Seong Jae Lim, Hye Ryeong JUN, Jin Sung Choi +1 more | 2018-08-07 |
| 9893045 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow, Byung Tai Do, Linda Pei Ee Chua | 2018-02-13 |
| 9846804 | Apparatus and method for creating three-dimensional personalized figure | Seong Jae Lim, Bon Woo Hwang, Kap Kee Kim, Hye Ryeong JUN, Jin Sung Choi +1 more | 2017-12-19 |
| 9754858 | Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die | Reza A. Pagaila, Yaojian Lin | 2017-09-05 |
| 9484279 | Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die | Reza A. Pagaila, Flynn Carson | 2016-11-01 |
| 9245380 | Local multi-resolution 3-D face-inherent model generation apparatus and method and facial skin management system | Kap Kee Kim, Bon Woo Hwang, Ji Hyung Lee, Bon Ki Koo | 2016-01-26 |
| 9240380 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow | 2016-01-19 |
| 9189857 | Apparatus and method for reconstructing three dimensional faces based on multiple cameras | Kap Kee Kim, Bon Woo Hwang, Ji Hyung Lee, Bon Ki Koo | 2015-11-17 |
| 8957530 | Integrated circuit packaging system with embedded circuitry and post | Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan, Jong-Woo Ha | 2015-02-17 |
| 8922547 | 3D model shape transformation method and apparatus | Seong Jae Lim, Han-Byul Joo, Ji Hyung Lee, Bon Ki Koo | 2014-12-30 |
| 8902305 | System and method for managing face data | Bon Woo Hwang, Kap Kee Kim, Bonki Koo, Ji Hyung Lee | 2014-12-02 |
| 8896109 | Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die | Reza A. Pagaila, Seng Guan Chow | 2014-11-25 |
| 8822281 | Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier | Reza A. Pagaila, Yaojian Lin | 2014-09-02 |
| 8682107 | Apparatus and method for creating 3D content for oriental painting | Seong Jae Lim | 2014-03-25 |
| 8518746 | Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die | Reza A. Pagaila, Yaojian Lin | 2013-08-27 |
| 8383457 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Reza A. Pagaila, Seng Guan Chow | 2013-02-26 |