| 12469819 |
Semiconductor device and method of forming embedded wafer level chip scale packages |
Yancen Lin, Pandi C. Marimuthu, Byung-Hee Han |
2025-11-11 |
|
| 12302657 |
Semiconductor device and method of forming an optical semiconductor package with a shield structure |
Emmanuel Espiritu, Jeffrey D. Punzalan, Teddy Joaquin Carreon |
2025-05-13 |
|
| 12211863 |
Reliable semiconductor packages |
Jeffrey D. Punzalan, Emmanuel Espiritu, Allan P. Ilagan, Teddy Joaquin Carreon |
2025-01-28 |
|
| 12166050 |
Reliable semiconductor packages |
Jeffrey D. Punzalan |
2024-12-10 |
|
| 12100719 |
Reliable semiconductor packages |
Jeffrey D. Punzalan |
2024-09-24 |
|
| 11961764 |
Semiconductor device and method of making a wafer-level chip-scale package |
Thomas Strothmann, Damien M. Pricolo, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more |
2024-04-16 |
|
| 11901308 |
Semiconductor packages with integrated shielding |
Saravuth Sirinorakul, Kok Chuen Lock, Roel Adeva Robles, Eakkasit Dumsong |
2024-02-13 |
|
| 11881494 |
Semiconductor package with dams |
Jeffrey D. Punzalan |
2024-01-23 |
|
| 11842991 |
Semiconductor device and method of forming a 3D interposer system-in-package module |
DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon |
2023-12-12 |
|
| 11715703 |
EMI shielding for flip chip package with exposed die backside |
SungWon Cho, ChangOh Kim, InSang Yoon, KyoungHee Park |
2023-08-01 |
|
| 11670521 |
Reliable semiconductor packages for sensor chips |
Jeffrey D. Punzalan |
2023-06-06 |
|
| 11488933 |
Semiconductor device and method of forming embedded wafer level chip scale packages |
Yaojian Lin, Pandi C. Marimuthu, Byung Joon Han |
2022-11-01 |
|
| 11488932 |
Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages |
Byung Joon Han, Yaojian Lin, Pandi C. Marimuthu |
2022-11-01 |
|
| 11342278 |
EMI shielding for flip chip package with exposed die backside |
SungWon Cho, ChangOh Kim, InSang Yoon, KyoungHee Park |
2022-05-24 |
|
| 11319207 |
Semiconductor device and method of forming MEMS package |
Yaojian Lin |
2022-05-03 |
|
| 11145603 |
Integrated circuit packaging system with shielding and method of manufacture thereof |
Byung Joon Han, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more |
2021-10-12 |
|
| 11127668 |
Semiconductor device and method of forming double-sided fan-out wafer level package |
Pandi C. Marimuthu, Won Kyoung Choi, Sze Ping Goh, Jose Alvin Caparas |
2021-09-21 |
|
| 11024561 |
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units |
Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu |
2021-06-01 |
|
| 11024585 |
Integrated circuit packaging system with shielding and method of manufacture thereof |
Byung Joon Han, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more |
2021-06-01 |
|
| 11011423 |
Semiconductor device and method of using a standardized carrier in semiconductor packaging |
Thomas Strothmann, Damien M. Pricolo, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more |
2021-05-18 |
|
| 10804217 |
EMI shielding for flip chip package with exposed die backside |
SungWon Cho, ChangOh Kim, InSang Yoon, KyoungHee Park |
2020-10-13 |
|
| 10797039 |
Semiconductor device and method of forming a 3D interposer system-in-package module |
DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon |
2020-10-06 |
|
| 10790158 |
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern |
Yaojian Lin, Kang Chen, Hin Hwa Goh |
2020-09-29 |
|
| 10777528 |
Semiconductor device and method of forming embedded wafer level chip scale packages |
Yaojian Lin, Pandi C. Marimuthu, Byung Joon Han |
2020-09-15 |
|
| 10730745 |
Semiconductor device and method of forming MEMS package |
Yaojian Lin |
2020-08-04 |
|