Issued Patents All Time
Showing 25 most recent of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12302657 | Semiconductor device and method of forming an optical semiconductor package with a shield structure | Emmanuel Espiritu, Jeffrey D. Punzalan, Teddy Joaquin Carreon | 2025-05-13 |
| 12211863 | Reliable semiconductor packages | Jeffrey D. Punzalan, Emmanuel Espiritu, Allan P. Ilagan, Teddy Joaquin Carreon | 2025-01-28 |
| 12166050 | Reliable semiconductor packages | Jeffrey D. Punzalan | 2024-12-10 |
| 12100719 | Reliable semiconductor packages | Jeffrey D. Punzalan | 2024-09-24 |
| 11961764 | Semiconductor device and method of making a wafer-level chip-scale package | Thomas Strothmann, Damien M. Pricolo, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2024-04-16 |
| 11901308 | Semiconductor packages with integrated shielding | Saravuth Sirinorakul, Kok Chuen Lock, Roel Adeva Robles, Eakkasit Dumsong | 2024-02-13 |
| 11881494 | Semiconductor package with dams | Jeffrey D. Punzalan | 2024-01-23 |
| 11842991 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon | 2023-12-12 |
| 11715703 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, InSang Yoon, KyoungHee Park | 2023-08-01 |
| 11670521 | Reliable semiconductor packages for sensor chips | Jeffrey D. Punzalan | 2023-06-06 |
| 11488932 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Yaojian Lin, Pandi C. Marimuthu | 2022-11-01 |
| 11488933 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Pandi C. Marimuthu, Byung Joon Han | 2022-11-01 |
| 11342278 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, InSang Yoon, KyoungHee Park | 2022-05-24 |
| 11319207 | Semiconductor device and method of forming MEMS package | Yaojian Lin | 2022-05-03 |
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2021-10-12 |
| 11127668 | Semiconductor device and method of forming double-sided fan-out wafer level package | Pandi C. Marimuthu, Won Kyoung Choi, Sze Ping Goh, Jose Alvin Caparas | 2021-09-21 |
| 11024561 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu | 2021-06-01 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, KyoungHee Park, Yaojian Lin, KyoWang Koo, In Sang Yoon +5 more | 2021-06-01 |
| 11011423 | Semiconductor device and method of using a standardized carrier in semiconductor packaging | Thomas Strothmann, Damien M. Pricolo, Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon +1 more | 2021-05-18 |
| 10804217 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, InSang Yoon, KyoungHee Park | 2020-10-13 |
| 10797039 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, OhHan Kim, HeeSoo Lee, HunTeak Lee, InSang Yoon | 2020-10-06 |
| 10790158 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Yaojian Lin, Kang Chen, Hin Hwa Goh | 2020-09-29 |
| 10777528 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Pandi C. Marimuthu, Byung Joon Han | 2020-09-15 |
| 10730745 | Semiconductor device and method of forming MEMS package | Yaojian Lin | 2020-08-04 |
| 10707150 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Yu Gu | 2020-07-07 |